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CORC

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A Hybrid Architecture for Astronomical Computing 会议论文
Italian Natl Inst Astrophys, Trieste Astron Observ, Trieste, ITALY, 2016-10-16
作者:  Li, Changhua;  Cui, Chenzhou;  He, Boliang;  Fan, Dongwei;  Mi, Linying
收藏  |  浏览/下载：102/0  |  提交时间：2019/12/02
Design and Implement of Astronomical Cloud Computing Environment In China-VO 会议论文
Sorrento (Naples), Italy, Oct 19 - Oct 25, 2016
作者:  Li, Shanshan;  Song, Wenming;  Chen, Xiao;  Liu, Liang;  Fan, Yufeng
收藏  |  浏览/下载：38/0  |  提交时间：2018/02/07
The cooling control system for focal plane assembly of astronomical satellite camera based on TEC 会议论文
2nd international conference on photonics and optical engineering, xi'an, china, 2016-10-14
作者:  Yuqing, He;  Yunfei, Du;  Wei, Gao;  Baopeng, Li;  Xuewu, Fan
收藏  |  浏览/下载：28/0  |  提交时间：2017/05/15
Design and Implement of Astronomical Cloud Computing Environment In China-VO 会议论文
325th Symposium of the International-Astronomical-Union (IAU), Sorrento, ITALY, OCT 19-25, 2016
作者:  Li, Changhua*;  Cui, Chenzhou;  Mi, Linying;  He, Boliang;  Fan, Dongwei
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/23
The Numerical Simulation and Experiment on Temperature Field in ICF Driver's Target Building 会议论文
Guilin, PEOPLES R CHINA, APR 09-11, 2011
作者:  Zhou, Yi[1,2];  Liao, Yunfei[1,2];  He, Jie[2]
收藏  |  浏览/下载：3/0  |  提交时间：2019/11/28
Hermetic Packaging of Kovar Alloy and Low-carbon Steel Structure in Hybrid Integrated Circuit (HIC) System Using Parallel Seam Welding Proces (CPCI-S收录) 会议论文
2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
作者:  Wang, Junde[1];  He, Xiaoqi[1];  Li, Xunping[1];  En, Yunfei[1];  Zhang, Xinping[2]
收藏  |  浏览/下载：7/0  |  提交时间：2019/04/12
Critical factors on the hermetic characteristics of DC/DC power module (EI收录) 会议论文
Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, Suzhou, China, July 15, 2013 - July 19, 2013
作者:  Li, Xunping[1];  He, Xiaoqi[1];  En, Yunfei[1];  Qi, Guo[2]
收藏  |  浏览/下载：4/0  |  提交时间：2019/04/15
The effect of Pb contamination on the solidification behaviors and mechanical properties of backward compatible solder joints (EI收录) 会议论文
Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, Suzhou, China, July 15, 2013 - July 19, 2013
作者:  Li, Xunping[1];  Bin, Zhou[1];  En, Yunfei[1];  Xiaoqi, He[1];  Wei, Xiongfeng[2]
收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15
The Function of IR thermal imaging technology for device and circuit reliability research (CPCI-S收录) 会议论文
2014 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC)
作者:  Song, Fang Fang[1,2];  He, Xiaoqi[2];  En, Yunfei[2]
收藏  |  浏览/下载：1/0  |  提交时间：2019/04/12
Hermetically metal Sealing Random Vibration Damage Mechanism and Fatigue Life Prediction (CPCI-S收录) 会议论文
APPLIED MATERIALS AND TECHNOLOGIES FOR MODERN MANUFACTURING, PTS 1-4
作者:  Han, Teng[1,2];  He, Xiaoqi[2];  En, Yunfei[2]
收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15

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