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CORC

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Surface oxide analysis of lead-free solder particles 期刊论文
SOLDERING & SURFACE MOUNT TECHNOLOGY, 2013, 卷号: 25, 页码: 39-44
作者:  Luo, Xin[1];  Du, Wenhui[2];  Lu, Xiuzhen[3];  Yamaguchi, Toshikazu[4];  Jackson, Gavin[5]
收藏  |  浏览/下载：7/0  |  提交时间：2019/04/30
Study on Low Silver Sn-Ag-Cu-P Alloy for Wave Soldering 会议论文
PROCEEDINGS OF THE 2013 20TH IEEE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL & FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA 2013), 2013-07-15
作者:  Wang, Junjie[1];  Wei, Xicheng[2];  Zhu, Wenqi[3];  Wu, Jian[4];  Wu, Nianzu[5]
收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30
Interfacial IMC layer growth and tensile properties of low-silver Cu/SACBE/Cu solder joints 期刊论文
SOLDERING & SURFACE MOUNT TECHNOLOGY, 2012, 卷号: 24, 页码: 249-256
作者:  Bi, Wenzhen[1];  Ju, Guokui[2];  Lin, Fei[3];  Xie, Shifang[4];  Wei, Xicheng[5]
收藏  |  浏览/下载：3/0  |  提交时间：2019/04/30
TiO2 Nanoparticles Functionalized Sn/3.0Ag/0.5Cu Lead-free Solder 会议论文
2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012-08-13
作者:  Rui, Manman[1];  Lui, Xiuzhen[2];  Chen, Si[3];  Ye, Lilei[4];  Liu, Johan[5]
收藏  |  浏览/下载：4/0  |  提交时间：2019/04/30
The comparative study on interfacial IMCs growth of three Cu/SnAgCu/Cu solder joints with Bi and Cr additions during thermal aging 会议论文
2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012-08-13
作者:  Ju, Guokui[1];  Bi, Wenzhen[2];  Lin, Fei[3];  Han, Yongjiu[4];  Wei, Xicheng[5]
收藏  |  浏览/下载：6/0  |  提交时间：2019/04/30
Microstructure and Properties of Sn3Ag0.5Cu3Bi0.05Cr/Cu Solder Joint 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2011, 卷号: 40, 页码: 252-256
作者:  Han Yongjiu[1];  Lin Fei[2];  Su Guobiao[3];  Ju Guokui[4];  Wei Xicheng[5]
收藏  |  浏览/下载：4/0  |  提交时间：2019/04/30
Melting and solidification properties of the nanoparticles of Sn3.0Ag0.5Cu lead-free solder alloy 期刊论文
MATERIALS CHARACTERIZATION, 2010, 卷号: 61, 页码: 474-480
作者:  Zou, Changdong[1];  Gao, Yulai[2];  Yang, Bin[3];  Zhai, Qijie[4]
收藏  |  浏览/下载：4/0  |  提交时间：2019/04/30
A Reliability Study of Nanoparticles Reinforced Composite Lead-Free Solder 期刊论文
MATERIALS TRANSACTIONS, 2010, 卷号: 51, 页码: 1720-1726
作者:  Chen, Si[1];  Zhang, Lili[2];  Liu, Johan[3];  Gao, Yulai[4];  Zhai, Qijie[5]
收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30
Effect of corrosion on the low cycle fatigue behavior of Sn-4.0Ag-0.5Cu lead-free solder joints 期刊论文
INTERNATIONAL JOURNAL OF FATIGUE, 2008, 卷号: 30, 页码: 917-930
作者:  Andersson, C.[1];  Liu, J.[2]
收藏  |  浏览/下载：2/0  |  提交时间：2019/05/06
Tensile properties and microstructural characterization of Sn-0.7Cu-0.4Co bulk solder alloy for electronics applications 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2008, 卷号: 457, 页码: 97-105
作者:  Andersson, Cristina[1];  Sun, Peng[2];  Liu, Johan[3]
收藏  |  浏览/下载：3/0  |  提交时间：2019/05/06

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