| TiO2 Nanoparticles Functionalized Sn/3.0Ag/0.5Cu Lead-free Solder | |
| Rui, Manman[1]; Lui, Xiuzhen[2]; Chen, Si[3]; Ye, Lilei[4]; Liu, Johan[5] | |
| 2012 | |
| 会议名称 | 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) |
| 会议日期 | 2012-08-13 |
| 页码 | 203-207 |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2299563 |
| 专题 | 上海大学 |
| 作者单位 | 1.Shanghai Univ, Key State Lab New Displays & Syst Applicat, Shanghai 200072, Peoples R China. 2.Shanghai Univ, Key State Lab New Displays & Syst Applicat, Box 282,Yanchang Rd 149, Shanghai 200072, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Rui, Manman[1],Lui, Xiuzhen[2],Chen, Si[3],et al. TiO2 Nanoparticles Functionalized Sn/3.0Ag/0.5Cu Lead-free Solder[C]. 见:2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012). 2012-08-13. |
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