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CORC

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Inverse engineering of shortcut pulses for high fidelity initialization on qubits closely spaced in frequency 期刊论文
OPTICS EXPRESS, 2019, 卷号: 27, 页码: 8267-8282
作者:  Yan, Ying[1];  Li, Yichao[2];  Kinos, Adam[3];  Walther, Andreas[4];  Shi, Chunyan[5]
收藏  |  浏览/下载：3/0  |  提交时间：2019/04/22
The influence of sintering process on thermal properties of nano-silver paste 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Lu, Xiuzhen[1];  Zhang, Qianran[2];  Zehri, Abdelhafid[3];  Ke, Wei[4];  Huang, Shirong[5]
收藏  |  浏览/下载：15/0  |  提交时间：2019/04/22
Effective atomic interface engineering in Bi2Te2.7Se0.3 thermoelectric material by atomic-layer-deposition approach 期刊论文
NANO ENERGY, 2018, 卷号: 49, 页码: 257-266
作者:  Li, Shuankui[1];  Liu, Yidong[2];  Liu, Fusheng[3];  He, Dongsheng[4];  He, Jiaqing[5]
收藏  |  浏览/下载：12/0  |  提交时间：2019/04/22
Optimized hetero-interfaces by tuning 2D SnS2 thickness in Bi2Te2.7Se0.3/SnS2 nanocomposites to enhance thermoelectric performance 期刊论文
NANO ENERGY, 2017, 卷号: 39, 页码: 297-305
作者:  Li, Shuankui[1];  Liu, Xuerui[2];  Liu, Yidong[3];  Liu, Fusheng[4];  Luo, Jun[5]
收藏  |  浏览/下载：8/0  |  提交时间：2019/04/24
Graphene-based heater 会议论文
IMAPS Nordic Annual Conference 2016, 2016-06-05
作者:  Zhang, Yong[1];  Edwards, Michael[2];  Fu, Yifeng[3];  Liu, Johan[4]
收藏  |  浏览/下载：4/0  |  提交时间：2019/04/26
Enhanced cold wall CVD reactor growth of horizontally aligned single-walled carbon nanotubes 期刊论文
ELECTRONIC MATERIALS LETTERS, 2016, 卷号: 12, 页码: 329-337
作者:  Mu, Wei[1];  Kwak, Eun-Hye[2];  Chen, Bingan[3];  Huang, Shirong[4];  Edwards, Michael[5]
收藏  |  浏览/下载：4/0  |  提交时间：2019/04/26
Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects 期刊论文
NANOTECHNOLOGY, 2016, 卷号: 27, 页码: 335705
作者:  Sun, Shuangxi[1];  Mu, Wei[2];  Edwards, Michael[3];  Mencarelli, Davide[4];  Pierantoni, Luca[5]
收藏  |  浏览/下载：2/0  |  提交时间：2019/04/26
Development of self-assembling peptide nanovesicle with bilayers for enhanced EGFR-targeted drug and gene delivery 期刊论文
BIOMATERIALS, 2016, 卷号: 82, 页码: 194-207
作者:  Liang, Xiaofei[1];  Shi, Bizhi[2];  Wang, Kai[3];  Fan, Mingliang[4];  Jiao, Dejin[5]
收藏  |  浏览/下载：13/0  |  提交时间：2019/04/26
Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging 期刊论文
MICROELECTRONICS RELIABILITY, 2016, 卷号: 56, 页码: 129-135
作者:  Sun, Shuangxi[1];  Chen, Si[2];  Luo, Xin[3];  Fu, Yifeng[4];  Ye, Lilei[5]
收藏  |  浏览/下载：2/0  |  提交时间：2019/04/26
Influence of nano additives on mechanical properties and reliability of interconnects made by electrically conductive adhesives on elastic substrates for printed electronics application 会议论文
15th International Conference on Electronic Packaging Technology (ICEPT), 2014-08-12
作者:  Sitek, Janusz[1];  Koscielski, Marek[2];  Zhang, Yan[3];  Fan, Jing-Yu[4];  Ma, Shiwei[5]
收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30

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