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	Influence of nano additives on mechanical properties and reliability of interconnects made by electrically conductive adhesives on elastic substrates for printed electronics application
	Sitek, Janusz[1]; Koscielski, Marek[2]; Zhang, Yan[3]; Fan, Jing-Yu[4]; Ma, Shiwei[5]; Liu, Johan[6]
	2014
会议名称	15th International Conference on Electronic Packaging Technology (ICEPT)
会议日期	2014-08-12
关键词	Electrically conductive adhesives nano additives mechanical properties reliability of interconnects printed electronics
页码	151-154
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2272272
专题	上海大学
作者单位	1.[1]Tele & Radio Res Inst, Warsaw, Poland. 2.[2]Tele & Radio Res Inst, Warsaw, Poland. 3.[3]Shanghai Univ, Shanghai 200072, Peoples R China. 4.[4]Shanghai Univ, Shanghai 200072, Peoples R China. 5.[5]Shanghai Univ, Shanghai 200072, Peoples R China. 6.[6]Chalmers, SE-41296 Gothenburg, Sweden.
推荐引用方式 GB/T 7714	Sitek, Janusz[1],Koscielski, Marek[2],Zhang, Yan[3],et al. Influence of nano additives on mechanical properties and reliability of interconnects made by electrically conductive adhesives on elastic substrates for printed electronics application[C]. 见:15th International Conference on Electronic Packaging Technology (ICEPT). 2014-08-12.

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