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科研机构
金属研究所 [12]
内容类型
期刊论文 [12]
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2022 [4]
2020 [2]
2018 [4]
2017 [1]
2014 [1]
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Chemistry,... [1]
Materials ... [1]
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Controlled Growth of Wafer-Scale Transition Metal Dichalcogenides with a Vertical Composition Gradient for Artificial Synapses with High Linearity
期刊论文
ACS NANO, 2022, 卷号: 16, 期号: 8, 页码: 12318-12327
作者:
Tang, Lei
;
Teng, Changjiu
;
Xu, Runzhang
;
Zhang, Zehao
;
Khan, Usman
收藏
  |  
浏览/下载:17/0
  |  
提交时间:2022/10/08
vertical composition gradient
transition metal dichalcogenides
chemical vapor deposition
wafer-scale
artificial synapses
device array
linearity
High-performance gold/graphene/germanium photodetector based on a graphene-on-germanium wafer
期刊论文
NANOTECHNOLOGY, 2022, 卷号: 33, 期号: 34, 页码: 7
作者:
Jiang, Haiyan
;
Li, Bo
;
Wei, Yuning
;
Feng, Shun
;
Di, Zengfeng
收藏
  |  
浏览/下载:41/0
  |  
提交时间:2022/07/14
graphene
germanium
2D material
Fermi-level pinning
photodetector
Fermi-Level Depinning in Metal/Ge Junctions by Inserting a Carbon Nanotube Layer
期刊论文
SMALL, 2022, 页码: 7
作者:
Wei, Yu-Ning
;
Hu, Xian-Gang
;
Zhang, Jian-Wei
;
Tong, Bo
;
Du, Jin-Hong
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  |  
浏览/下载:36/0
  |  
提交时间:2022/07/14
carbon nanotube films
Fermi-level pinning
germanium
metal-induced gap states
ohmic contacts
Patterning of Wafer-Scale MXene Films for High-Performance Image Sensor Arrays
期刊论文
ADVANCED MATERIALS, 2022, 页码: 8
作者:
Li, Bo
;
Zhu, Qian-Bing
;
Cui, Cong
;
Liu, Chi
;
Wang, Zuo-Hua
收藏
  |  
浏览/下载:24/0
  |  
提交时间:2022/07/01
image sensor arrays
MXenes
MXene photodetectors
wafer-scale patterning technology
Focused ion beam preparation of microbeams forin situmechanical analysis of electroplated nanotwinned copper with probe type indenters
期刊论文
JOURNAL OF MICROSCOPY, 2020, 卷号: 279, 期号: 3, 页码: 212-216
作者:
Robertson, Stuart
;
Doak, Scott
;
Sun, Fu-Long
;
Liu, Zhi-Quan
;
Liu, Changqing
收藏
  |  
浏览/下载:28/0
  |  
提交时间:2021/02/02
Chunk lift-out
focused ion beam
in situ
micromechanical testing
nanotwinned copper
P-FIB
Vertical Chemical Vapor Deposition Growth of Highly Uniform 2D Transition Metal Dichalcogenides
期刊论文
ACS NANO, 2020, 卷号: 14, 期号: 4, 页码: 4646-4653
作者:
Tang, Lei
;
Li, Tao
;
Luo, Yuting
;
Feng, Simin
;
Cai, Zhengyang
收藏
  |  
浏览/下载:47/0
  |  
提交时间:2021/02/02
two-dimensional materials
TMDCs
gaseous sources
VCVD
uniformity
heterostructures
Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package
期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 8, 页码: 1305-1314
作者:
Gao, LY
;
Zhang, H
;
Li, CF
;
Guo, JD
;
Liu, ZQ
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  |  
浏览/下载:29/0
  |  
提交时间:2018/12/25
Fe-Ni under bump metallization (UBM)
Intermetallic compounds (IMCs)
Electromigration (EM)
Diffusion
Vacancy formation
Chemical Vapor Deposition Growth and Applications of Two-Dimensional Materials and Their Heterostructures
期刊论文
CHEMICAL REVIEWS, 2018, 卷号: 118, 期号: 13, 页码: 6091-6133
作者:
Cai, ZY
;
Liu, BL
;
Zou, XL
;
Cheng, HM
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2018/12/25
Chemical Vapor Deposition Growth and Applications of Two-Dimensional Materials and Their Heterostructures
期刊论文
CHEMICAL REVIEWS, 2018, 卷号: 118, 期号: 13, 页码: 6091-6133
作者:
Cai, Zhengyang
;
Liu, Bilu
;
Zou, Xiaolong
;
Cheng, Hui-Ming
收藏
  |  
浏览/下载:27/0
  |  
提交时间:2021/02/02
Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate
期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 10, 页码: 1885-1890
作者:
Sun FuLong
;
Gao LiYin
;
Liu ZhiQuan
;
Zhang Hao
;
Sugahara Tohru
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2021/02/02
NI SOLDER JOINTS
NANO-SCALE TWINS
INTERFACIAL RELIABILITY
FE-NI
COPPER
METALS
DEFORMATION
STRENGTH
DEPENDENCE
BOUNDARIES
Electrodeposition
Nanotwinned Cu
Growth mechanism
Acid adsorption
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