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CORC

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Fabrication of Large Aerogel-Like Carbon/Carbon Composites with Excellent Load-Bearing Capacity and Thermal-Insulating Performance at 1800 degrees C 期刊论文
ACS NANO, 2022, 卷号: 16, 期号: 4, 页码: 6565-6577
作者:  Li, Jian;  Guo, Penglei;  Hu, Chenglong;  Pang, Shengyang;  Ma, Jian
收藏  |  浏览/下载：12/0  |  提交时间：2022/09/16
Similar and dissimilar resistance spot weldability of Q&P980 and TWIP1180 steels 期刊论文
SCIENCE AND TECHNOLOGY OF WELDING AND JOINING, 2021, 页码: 7
作者:  Wei, Shitong;  Li, Yiyi;  Lu, Shanping
收藏  |  浏览/下载：56/0  |  提交时间：2022/01/27
Thermal-Stress Coupling Effect on Microstructure Evolution of a Fourth-Generation Nickel-Based Single-Crystal Superalloy at 1100 degrees C 期刊论文
ACTA METALLURGICA SINICA, 2021, 卷号: 57, 期号: 2, 页码: 205-214
作者:  Xu Jinghui;  Li Longfei;  Liu Xingang;  Li Hui;  Feng Qiang
收藏  |  浏览/下载：28/0  |  提交时间：2021/10/15
Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
作者:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan
收藏  |  浏览/下载：129/0  |  提交时间：2021/02/02
Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 19, 页码: 17583-17590
作者:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-quan;  Sun, Lei;  Xiong, Ming-yue
收藏  |  浏览/下载：13/0  |  提交时间：2021/02/02
Research on Single SiC Fiber Reinforced TC17 Composites Under Transverse Tension 期刊论文
ACTA METALLURGICA SINICA, 2018, 卷号: 54, 期号: 12, 页码: 1809-1817
作者:  Liu Jialin;  Wang Yumin;  Zhang Guoxing;  Zhang Xu;  Yang Lina
收藏  |  浏览/下载：116/0  |  提交时间：2021/02/02
Surface Modification of High Performance Fibers and Interfacial Properties of Their Reinforced Bismaleimide Resin Matrix Composites 期刊论文
ACTA POLYMERICA SINICA, 2018, 期号: 3, 页码: 323-335
作者:  Chen Ping;  Yu Qi;  Xiong Xuhai;  Liu Dong;  Liu Zhe
收藏  |  浏览/下载：85/0  |  提交时间：2021/02/02
A superior interfacial reliability of Fe-Ni UBM during high temperature storage 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2017, 卷号: 28, 期号: 12, 页码: 8537-8545
Gao, Li-Yin; Li, Cai-Fu; Wan, Peng; Liu, Zhi-Quan
收藏  |  浏览/下载：22/0  |  提交时间：2017/08/17
Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction 期刊论文
Journal of Electronic Materials, 2013, 卷号: 42, 期号: 12, 页码: 3552-3558
L. M. Yang; Z. F. Zhang
收藏  |  浏览/下载：11/0  |  提交时间：2013/12/24
Influences of reflow time and strain rate on interfacial fracture behaviors of Sn-4Ag/Cu solder joints 期刊论文
Journal of Applied Physics, 2012, 卷号: 112, 期号: 6
Q. K. Zhang; Z. F. Zhang
收藏  |  浏览/下载：17/0  |  提交时间：2013/02/05

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