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浏览/检索结果: 共3条，第1-3条 帮助 限定条件 专题：北京航空航天大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Theoretical prediction for thermal expansion coefficients of unidirectional fiber-reinforced composites with variable elliptical cross-sections 期刊论文 POLYMER COMPOSITES, 2019, 卷号: 40, 页码: 187-201 作者:  Guo, Fangliang;  Yan, Ying;  Hong, Yang;  Li, Xin;  Ye, Jinxin 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30 Fiber reinforced plastics  Fibers  Forecasting  Reinforcement  Thermal expansion  Coefficients of thermal expansions  Elliptical cross section  Fiber reinforced composites  Fiber volume fractions  Theoretical solutions  Thermal expansion coefficients  Transversely isotropic fibers  Unidirectional fibers  Finite element method   Prediction and optimization design for thermal expansion coefficients of three-dimensional n-directional-braided composites 期刊论文 POLYMER COMPOSITES, 2019, 卷号: 40, 页码: 2495-2509 作者:  Guo, Fangliang;  Yan, Ying;  Hong, Yang;  Tian, Ziyang;  Li, Jie 收藏  |  浏览/下载：11/0  |  提交时间：2019/12/30 Composite materials  Elasticity  Finite element method  Forecasting  Genetic algorithms  Multiobjective optimization  Plastic products  Structural design  Thermal expansion  Yarn  3-d braided composites  Braided composites  Braiding parameters  Coefficients of thermal expansions  Fiber cross section  Optimization design  Thermal expansion coefficients  Thermal expansion performance  Three dimensional computer graphics   Mechanically strengthened graphene-Cu composite with reduced thermal expansion towards interconnect applications 期刊论文 MICROSYSTEMS & NANOENGINEERING, 2019, 卷号: 5, 页码: 20 作者:  An, Zhonglie;  Li, Jinhua;  Kikuchi, Akio;  Wang, Zhuqing;  Jiang, Yonggang 收藏  |  浏览/下载：101/0  |  提交时间：2019/12/30 Copper compounds  Electronics packaging  Graphene  Integration  Mechanical properties  MEMS  Natural frequencies  Thermal expansion  Three dimensional integrated circuits  Coefficients of thermal expansions  Composite microstructures  Interconnect applications  Laser Doppler vibrometers  Mechanical resonant frequencies  Micro electro mechanical system  Thermal expansion mismatch  Through-Silicon-Via (TSV)  Integrated circuit interconnects