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Suppression of discontinuous precipitation in age-hardening Cu-15Ni-8Sn alloy by addition of V 期刊论文
Journal of Alloys and Compounds, 2020, 卷号: 813
作者:  Guo, Zhongkai;  Jie, Jinchuan;  Liu, Shichao;  Liu, Jiaming;  Yue, Shipeng
收藏  |  浏览/下载：60/0  |  提交时间：2019/12/02
Effect of Sn addition on morphology evolution of secondary phase in hypomonotectic Cu-Pb-Sn alloy during solidification 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2019, 卷号: 791, 页码: 936-946
作者:  Dong, B. W.;  Jie, J. C.;  Yao, X. X.;  Liu, S. C.;  Chen, Y. H.
收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02
Effect of V addition on microstructures and mechanical properties of Cu-15Ni-8Sn alloy 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 748, 页码: 85-94
作者:  Guo, Zhongkai;  Jie, Jinchuan;  Liu, Shichao;  Zhang, Yubo;  Qin, Bailiang
收藏  |  浏览/下载：137/0  |  提交时间：2019/12/02
Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 4359-4369
作者:  Huang, Ru;  Ma, Haoran;  Shang, Shengyan;  Kunwar, Anil;  Wang, Yunpeng
收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02
Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 2872-2887
作者:  Shang, Shengyan;  Kunwar, Anil;  Wang, Yanfeng;  Qu, Lin;  Ma, Haitao
收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02
Geometrical Effects of Cu@Ag Core-Shell Nanoparticles Treated Flux on the Growth Behaviour of Intermetallics in Sn/Cu Solder Joints 期刊论文
ELECTRONIC MATERIALS LETTERS, 2019, 卷号: 15, 页码: 253-265
作者:  Shang, Shengyan;  Kunwar, Anil;  Wang, Yanfeng;  Yao, Jinye;  Wu, Yingchao
收藏  |  浏览/下载：29/0  |  提交时间：2019/12/02
Geometrical effects on growth kinetics of interfacial intermetallic compounds in Sn/Cu joints reflowed with Cu nanoparticles doped flux 期刊论文
THIN SOLID FILMS, 2019, 卷号: 669, 页码: 198-207
作者:  Shang, Shengyan;  Kunwar, Anil;  Yao, Jinye;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：20/0  |  提交时间：2019/12/02
A loop of catholyte effluent feeding to bioanodes for complete recovery of Sn, Fe, and Cu with simultaneous treatment of the co-present organics in microbial fuel cells 期刊论文
SCIENCE OF THE TOTAL ENVIRONMENT, 2019, 卷号: 651, 页码: 1698-1708
作者:  Song, Xu;  Yang, Wulin;  Lin, Zheqian;  Huang, Liping;  Quan, Xie
收藏  |  浏览/下载：33/0  |  提交时间：2019/12/02
Grain nucleation and growth behavior of (Cu, Ni)6Sn5 in Sn�C10Cu�C1Ni alloy under pulse current: An in situ observation 期刊论文
Materials Characterization, 2019, 卷号: 158
作者:  Gao, Bingyang;  Guo, Enyu;  Meng, Xiangrui;  Nie, Shuang;  Liang, Hui
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
Effect of the TiO2 Nanoparticles on the Growth Behavior of Intermetallics in Sn/Cu Solder Joints 期刊论文
METALS AND MATERIALS INTERNATIONAL, 2019, 卷号: 25, 页码: 499-507
作者:  Shang, Shengyan;  Kunwar, Anil;  Yao, Jinye;  Wang, Yanfeng;  Ma, Haitao
收藏  |  浏览/下载：27/0  |  提交时间：2019/12/02

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