CORC

在结果中检索

CORC

浏览/检索结果: 共33条，第1-10条 帮助

限定条件                
已选(0)清除 条数/页：   排序方式：
Effect of Ag content on Cu6Sn5 growth behavior at Sn-Ag/Cu solder interface during multiple reflows 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Ma, Haoran;  Yao, Jinye;  Wang, Chen;  Shang, Shengyan;  Wang, Yunpeng
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02
Influence of Cu nanoparticles on Cu6Sn5 growth behavior at the interface of Sn/Cu solder joints 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Shang, Shengyan;  Kunwar, Anil;  Wang, Yanfeng;  Yao, Jinye;  Ma, Haitao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Growth Behavior of Cu6Sn5 Grains at Sn/(001)Cu Interface by Imposing Temperature Gradient 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhao, Ning;  Chen, Shi;  Liu, Chunying;  Zhong, Yi;  Ma, Haitao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
All-round suppression of Cu6Sn5 growth in Sn/Cu joints by utilizing TiO2 nanoparticles 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 页码: 15966-15972
作者:  Shang, Shengyan;  Kunwar, Anil;  Yao, Jinye;  Wang, Yunpeng
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints 期刊论文
MATERIALS RESEARCH BULLETIN, 2018, 卷号: 99, 页码: 239-248
作者:  Guo, Bingfeng;  Kunwar, Anil;  Zhao, Ning;  Chen, Jun;  Wang, Yunpeng
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder joints at the Sn/Cu liquid-solid interface during soldering cooling stage 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2017, 卷号: 28, 页码: 5398-5406
作者:  Guo, Bingfeng;  Ma, Haitao;  Jiang, Chengrong;  Wang, Yunpeng;  Kunwar, Anil
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02
In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/Cu L-S interface during soldering heat preservation stage 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
Effect of Ag concentration on the Cu6Sn5 growth in Sn-based solder/Cu joints at the isothermal reflow stage 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Guo, Bingfeng;  Jiang, Chengrong;  Kunwar, Anil;  Zhao, Ning;  Chen, Jun
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
Formation of preferred orientation of Cu6Sn5 grains in Cu/Sn/Cu interconnects by soldering under temperature gradient 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Zhong, Yi;  Zhao, Ning;  Dong, Wei;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/03
Continuous epitaxial growth of extremely strong Cu6Sn5 textures at liquid-Sn/(111)Cu interface under temperature gradient 期刊论文
APPLIED PHYSICS LETTERS, 2017, 卷号: 111
作者:  Zhong, Y.;  Zhao, N.;  Liu, C. Y.;  Dong, W.;  Qiao, Y. Y.
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/03

©版权所有 ©2017 CSpace - Powered by CSpace