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CORC

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Process Development of a New TGV Interposer for Wafer Level Package of Inertial MEMS Device 其他
2016-01-01
Ma, Shenglin; Ren, Kuili; Xia, Yanming; Yan, Jun; Luo, Rongfeng; Cai, Han; Jin, Yufeng; Ma, Mingjun; Jin, Zhonghe; Chen, Jing
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Low temperature multi-layer wafer level package for chip scale atomic clock (CSAC) 其他
2015-01-01
Li, Nannan; Zhang, Yangxi; Zhu, Ningli; Zhu, Yunhui; Gao, Chengchen; Chen, Jing
收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03
Low Temperature Multi-layer Wafer Level Package for Chip Scale Atomic Clock (CSAC) 其他
2015-01-01
Li, Nannan; Zhang, Yangxi; Zhu, Ningli; Zhu, Yunhui; Gao, Chengchen; Chen, Jing
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Fracture on infrared MEMS packaging 其他
2013-01-01
Xiaoxiong Zhou; Yongzheng Wen; Xiaomei Yu
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Wafer-level vacuum packaging for an optical readout bi-material cantilever infrared FPA 其他
2013-01-01
Li, Shuyu; Zhou, Xiaoxiong; Yu, Xiaomei
收藏  |  浏览/下载：6/0  |  提交时间：2015/11/13
Wafer-Level Vacuum Packaging for MEMS Resonators Using Glass Frit Bonding 期刊论文
journal of microelectromechanical systems, 2012
Wu, Guoqiang; Xu, Dehui; Xiong, Bin; Wang, Yuchen; Wang, Yuelin; Ma, Yinglei
收藏  |  浏览/下载：14/0  |  提交时间：2015/11/12
Investigation of a Unified LTCC-based Micromachining and Packaging Platform for High Density/Multifunctional Microsystem Integration 其他
2012-01-01
Miao, Min; Jin, Yufeng; Gan, Hua; Zhang, Jing; Qiu, Yunsong; Zhang, Yang; Zhang, Yangfei; Cao, Rui; Li, Zhensong; Wang, Zhengyi; Mu, Fangqing; Gao, Chengchen
收藏  |  浏览/下载：3/0  |  提交时间：2015/11/16
Wafer level Tungsten-Glass Bonding with Photosensitive BCB 其他
2012-01-01
Shan, Yi; Li, Nannan; Zhu, Yunhui; Zhang, Yiming; Chen, Suhui; Luo, Jin; Hu, Jia; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：4/0  |  提交时间：2015/11/16
Development of a Through-Stack-Via Integrated SRAM Module 其他
2012-01-01
Zhu, Yunhui; Sun, Xin; Ma, Shenglin; Cui, Qinghu; Zhong, Xiao; Bian, Yuan; Chen, Meng; Xiao, Yongqiang; Fang, Runiu; Liu, Zhenhua; Zhu, Zhiyuan; Gong, Xin; Chen, Jing; Miao, Min; Lu, Wengao; Jin, Yufeng
收藏  |  浏览/下载：5/0  |  提交时间：2015/11/16
Design and fabrication of high performance wafer-level vacuum packaging based on glass-silicon-glass bonding techniques 期刊论文
journal of micromechanics and microengineering, 2012
Zhang, Jinwen; Jiang, Wei; Wang, Xin; Zhou, Jilong; Yang, Huabing
收藏  |  浏览/下载：4/0  |  提交时间：2015/11/13

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