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Fabrication and Comparison of Bumpless Wafer-on-Wafer Integration and Bump-Containing Chip-on-Chip Integration 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2017
Guan, Yong; Zhu, Yunhui; Ma, Shenglin; Zeng, Qinghua; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Investigations of silicon wafer bonding utilizing sputtered Al and Sn films 期刊论文
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2017
Zhu, Zhiyuan; Yu, Min; Jin, Yufeng
收藏  |  浏览/下载：1/0  |  提交时间：2017/12/03
DEVICES  MEMS  
Fabrication and Characterization of Low Stress Si Interposer with Air-gapped Si Interconnection for Hermetical System-in-Package 其他
2016-01-01
Luo, Rongfeng; Ren, Kuili; Ma, Shenglin; Yan, Jun; Xia, Yanming; Jin, Yufeng; Chen, Jing; Wu, Tianzhun; Yang, Hangao; Yuan, Lifang
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Process Development of a New TGV Interposer for Wafer Level Package of Inertial MEMS Device 其他
2016-01-01
Ma, Shenglin; Ren, Kuili; Xia, Yanming; Yan, Jun; Luo, Rongfeng; Cai, Han; Jin, Yufeng; Ma, Mingjun; Jin, Zhonghe; Chen, Jing
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Investigation of thermal characteristics and two-phase flows of a star-shape thin heat pipe 期刊论文
APPLIED THERMAL ENGINEERING, 2016
Wang, Zhenyu; Zhang, Ning; Jiao, Binbin; Yu, Xinhai
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Low temperature multi-layer wafer level package for chip scale atomic clock (CSAC) 其他
2015-01-01
Li, Nannan; Zhang, Yangxi; Zhu, Ningli; Zhu, Yunhui; Gao, Chengchen; Chen, Jing
收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03
Discussion and analysis of Au/a-Si contact resistance in MEMS/NEMS devices 其他
2015-01-01
Fu, Fengshan; Yang, Fang; Wang, Wei; Huang, Xian; He, Jun; Zhang, Li; Guan, Taotao; Li, Rui; Zhang, Dacheng
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Silicon-silicon anodic bonding process with embedded glass 其他
2015-01-01
Cui, W.P.; Liu, G.D.; Zhang, F.S.; Hu, H.; Gao, C.C.; Hao, Y.L.
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
High temperature pressure sensor using Cu-Sn wafer level bonding 其他
2015-01-01
Liu, G.D.; Gao, C.C.; Zhang, Y.X.; Hao, Y.L.
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Quality evaluation and simulation of through-multilayer TSV integration process for memory stacking 其他
2015-01-01
Guan, Yong; Zeng, Qinghua; Chen, Jing; Jin, Yufeng; Ma, Shenglin
收藏  |  浏览/下载：8/0  |  提交时间：2017/12/03

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