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浏览/检索结果: 共6条，第1-6条 帮助 限定条件 内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 A study on the synthesis, characterization and properties of polyaniline nanofibers using ferric chloride as both oxidant and dopant 会议论文 Ding, Hang Jun; Yang, Zhou; Yang, Huai; Wan, Mei Xiang 收藏  |  浏览/下载：4/0  |  提交时间：2015/11/17 Effects of Thermocapillary Convection on the Growth Process in Industrial 8-inch Silicon Czochralski Growth 会议论文 14th International Conference on Crystal Growth (ICCG-14, ICVGE-12), Aug. 9-13, 2004, Grenoble, France 作者:  Chen QS(陈启生) 收藏  |  浏览/下载：1071/28  |  提交时间：2007/12/18 Effect of dopant on microstructure and mechanical properties of Pb-free solder joints (CPCI-S收录) 会议论文 ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS 作者:  Li, G. Y. 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/17 Effect of dopant on microstructure and mechanical properties of Pb-free solder joints (EI收录) 会议论文 Proceedings of the Electronic Packaging Technology Conference, EPTC, Shanghai, China, August 14, 2007 - August 17, 2007 作者:  Li, G.Y.[1] 收藏  |  浏览/下载：17/0  |  提交时间：2019/04/17 Activation energy  Alloys  Brazing  Copper  Copper alloys  Electronics packaging  Lead  Mechanical properties  Semiconducting intermetallics  Silver  Silver alloys  Soldering alloys  Technology  Tin alloys  Welding   Effect of nano-dopant on intermetallic compounds growth in Sn-3.0Ag-0.5Cu-xBi solder joints during aging process (EI收录) 会议论文 Proceedings of the Electronic Packaging Technology Conference, EPTC, Chengdu, China, August 12, 2014 - August 15, 2014 作者:  Tang, Y.[1,2];  Zhou, B.[3];  Huang, J.H.[1];  Wu, Z.Z.[1];  Li, G.Y.[1] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/12 Bismuth compounds  Copper compounds  Electronics packaging  Grain boundaries  Intermetallics  Lead  free solders  Microstructural evolution  Scanning electron microscopy  Silver  Soldered joints  Tin   Effect of nano-dopant on intermetallic compounds growth in Sn-3.0Ag-0.5Cu-xBi solder joints during aging process (CPCI-S收录) 会议论文 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Tang, Y.[1,2];  Zhou, B.[3];  Huang, J. H.[1];  Wu, Z. Z.[1];  Li, G. Y.[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/12 lead-free solder  nano-dopant  intermetallic growth  activation energy