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浏览/检索结果: 共7条，第1-7条 帮助 限定条件 内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Differential effects of Zn and Co solutes on the properties of Cu–Ni–Sn alloys 会议论文 作者:  Li, N.J.;  Li, X.N.;  Li, Z.M.;  Yu, Q.X.;  Zheng, Y.H. 收藏  |  浏览/下载：4/0  |  提交时间：2020/12/18 Cobalt alloys  Precipitation (chemical)  Solid solutionsAtomic site occupations  Composition analysis  Composition optimization  Comprehensive properties  Discontinuous precipitation  Microstructure and properties  Solid solution strengthening  Solution-treated alloys   Microstructure, Mechanical Properties, Corrosion Behavior and Hemolysis of As-Extruded Biodegradable Mg-Sn-Zn Alloy 会议论文 Hou, L.; Li, Z.; Pan, Y.; Du, L.; Li, X.; Zheng, Y.; Li, L. 收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03 Magnesium alloy  Extrusion ratio  Properties  IN-VIVO CORROSION  MAGNESIUM ALLOYS  TENSILE PROPERTIES   Wettability of Sn-Zn, Sn-Ag-Cu and Sn-Bi-Cu alloys on copper substrates 会议论文 Zhang, Xiaorui; Matsuura, Hiroyuki; Tsukihashi, Fumitaka; Yuan, Zhangfu 收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03 Effects of cerium on microstructure and electrochemical properties of Al-Zn-Sn sacrificial anodes 会议论文 作者:  He, Junguang;  Wen, Jiuba;  Li, Xudong 收藏  |  浏览/下载：5/0  |  提交时间：2019/11/15 Aluminium alloys  cerium  SEM  electrochemical properties   Crystallography of Mg2Sn precipitates in Mg-Sn-Mn-Si alloy 会议论文 TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, International Conference of Nonferrous Materials (ICNFM), Changsha, PEOPLES R CHINA, Web of Science Zhang Min; Zhang Wen-zheng; Zhu Guo-zhen; Yu Kun 收藏  |  浏览/下载：4/0 Zn Segregation at Precipitate/Matrix Interface in Mg-Sn-Zn Alloys 会议论文 San Diego, CA, FEB 26-MAR 02, 2017 作者:  Liu, Chaoqiang[1];  Chen, Houwen[1];  Nie, Jian-Feng[1,2] 收藏  |  浏览/下载：0/0  |  提交时间：2019/11/28 Processing performance and microstructure of Sn-Zn based solders modified by Bi and mixed rare earth elements (EI收录) 会议论文 ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, August 13, 2012 - August 16, 2012 作者:  Huang, Jia-Qiang[1];  Zhou, Min-Bo[1];  Li, Chang-Zheng[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Differential scanning calorimetry  Electronics packaging  Melting point  Microstructural evolution  Soldering  Soldering alloys  Wetting  Zinc