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Research on ultra-smooth collimation separation of silicon wafer by multiple lasers 会议论文
Suzhou, China, 2020-05-01
作者:  Youwang, Hu;  Ming, Li;  Qinqin, Xie;  Xiaoyan, Sun
收藏  |  浏览/下载:7/0  |  提交时间:2020/07/28
Modeling of mutual inductance between planar inductors on the same plane 会议论文
郑州, 2019-10-09-2019-10-10
作者:  Feng Zhang;  Chunyu Ma;  Ting Zhao
收藏  |  浏览/下载:32/0  |  提交时间:2019/10/08
Surface roughness measurement accuracy analysis of grinded silicon wafer by white light scanning interferometry (WLSI 会议论文
SPIE2019
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收藏  |  浏览/下载:4/0  |  提交时间:2019/12/02
Design of low noise avalanche photodiode single element detectors and linear arrays through CMOS process 会议论文
作者:  Cheng Zhengxi;  Xu Heliang;  Chen Yongping
收藏  |  浏览/下载:28/0  |  提交时间:2019/11/13
  
Investigation of effects of pattern structures arrangement on chemical mechanical polishing process 会议论文
Shanghai, China, March 11, 2018 - March 12, 2018
作者:  Wu, Lixiao;  Hahn, Sookap;  Yan, Changfeng
收藏  |  浏览/下载:1/0  |  提交时间:2020/11/15
Micropypamid silcon wafer with ZnO nanowires as high efficiency piezoelectric nanogererator 会议论文
上海, 2018
作者:  Xuecheng Yu;  Leicong Zhang;  Wen Jiang;  Pengli Zhu;  Rong Sun
收藏  |  浏览/下载:30/0  |  提交时间:2019/01/31
Development of Auto Infrared Photoelastic Microscope for Stress Measurement of Silicon 会议论文
Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018
作者:  Li, T.;  Yao, R.;  Yu, C.;  Su, F.
收藏  |  浏览/下载:4/0  |  提交时间:2019/12/30
Investigation the Effect of Silane onto Fabricating Polymer Insulation Layer by Spin-coating for Through Silicon Vias 会议论文
Harbin, China
作者:  Qiang Liu;  Guoping Zhang;  Rong Sun;  S. W. Ricky Lee;  Ching-Ping Wong
收藏  |  浏览/下载:14/0  |  提交时间:2018/02/02
Modeling of evolution process of edge over erosion in copper CMP using frequency components algorithm 会议论文
Shanghai, China, March 13, 2016 - March 14, 2016
作者:  Wu, Lixiao;  Hahn, Sookap;  Yan, Changfeng
收藏  |  浏览/下载:2/0  |  提交时间:2020/11/15
REPARATION OF MG-DOPED COLLOIDAL SILICA ABRASIVE AND ITS CHEMICAL MECHANICAL POLISHING PERFORMANCES ON SILICON WAFER 会议论文
China Semiconductor Technology International Conference (CSTIC), 2016-01-01
作者:  Ma, Pan[1];  Lei, Hong[2]
收藏  |  浏览/下载:3/0  |  提交时间:2019/04/26


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