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| Research on ultra-smooth collimation separation of silicon wafer by multiple lasers 会议论文 Suzhou, China, 2020-05-01 作者: Youwang, Hu; Ming, Li; Qinqin, Xie; Xiaoyan, Sun 收藏  |  浏览/下载:7/0  |  提交时间:2020/07/28
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| Modeling of mutual inductance between planar inductors on the same plane 会议论文 郑州, 2019-10-09-2019-10-10 作者: Feng Zhang; Chunyu Ma; Ting Zhao 收藏  |  浏览/下载:32/0  |  提交时间:2019/10/08
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| Surface roughness measurement accuracy analysis of grinded silicon wafer by white light scanning interferometry (WLSI 会议论文 SPIE2019 - 收藏  |  浏览/下载:4/0  |  提交时间:2019/12/02 |
| Design of low noise avalanche photodiode single element detectors and linear arrays through CMOS process 会议论文 作者: Cheng Zhengxi; Xu Heliang; Chen Yongping 收藏  |  浏览/下载:28/0  |  提交时间:2019/11/13
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| Investigation of effects of pattern structures arrangement on chemical mechanical polishing process 会议论文 Shanghai, China, March 11, 2018 - March 12, 2018 作者: Wu, Lixiao; Hahn, Sookap; Yan, Changfeng 收藏  |  浏览/下载:1/0  |  提交时间:2020/11/15
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| Micropypamid silcon wafer with ZnO nanowires as high efficiency piezoelectric nanogererator 会议论文 上海, 2018 作者: Xuecheng Yu; Leicong Zhang; Wen Jiang; Pengli Zhu; Rong Sun 收藏  |  浏览/下载:30/0  |  提交时间:2019/01/31 |
| Development of Auto Infrared Photoelastic Microscope for Stress Measurement of Silicon 会议论文 Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018 作者: Li, T.; Yao, R.; Yu, C.; Su, F. 收藏  |  浏览/下载:4/0  |  提交时间:2019/12/30
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| Investigation the Effect of Silane onto Fabricating Polymer Insulation Layer by Spin-coating for Through Silicon Vias 会议论文 Harbin, China 作者: Qiang Liu; Guoping Zhang; Rong Sun; S. W. Ricky Lee; Ching-Ping Wong 收藏  |  浏览/下载:14/0  |  提交时间:2018/02/02 |
| Modeling of evolution process of edge over erosion in copper CMP using frequency components algorithm 会议论文 Shanghai, China, March 13, 2016 - March 14, 2016 作者: Wu, Lixiao; Hahn, Sookap; Yan, Changfeng 收藏  |  浏览/下载:2/0  |  提交时间:2020/11/15
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| REPARATION OF MG-DOPED COLLOIDAL SILICA ABRASIVE AND ITS CHEMICAL MECHANICAL POLISHING PERFORMANCES ON SILICON WAFER 会议论文 China Semiconductor Technology International Conference (CSTIC), 2016-01-01 作者: Ma, Pan[1]; Lei, Hong[2] 收藏  |  浏览/下载:3/0  |  提交时间:2019/04/26 |