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浏览/检索结果: 共11条，第1-10条 帮助 限定条件 内容类型：会议论文    专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Phase Field Simulation of Solidification Behavior and Microstructure Evolution of Sn-58Bi/Cu Solder Interconnect During Reflow Soldering Proc (CPCI-S收录) 会议论文 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Ma, Wen-Jing[1];  Ke, Chang-Bo[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Sn-58Bi/Cu interconnect  Solidification  Undercooling  Dendrite morphology  Phase field simulation   Phase field simulation of solidification behavior and microstructure evolution of Sn-58Bi/Cu solder interconnect during reflow soldering proc (EI收录) 会议论文 Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China, August 11, 2013 - August 14, 2013 作者:  Ma, Wen-Jing[1];  Ke, Chang-Bo[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Anisotropy  Electronics packaging  Flip chip devices  Microstructure  Morphology  Soldering  Soldering alloys  Solidification  Undercooling   A Multi-Phase Field Study of the Role of Grain Boundary Diffusion in Growth of Cu6Sn5 Intermetallic Compound during Early Stage of Soldering (CPCI-S收录) 会议论文 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Ke, Chang-Bo[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Intermetallic compound  Growth kinetics  Size distribution  Soldering reaction  Multi-phase field simulation   Morphological characterization and distribution of autocatalytic-grown Ni4Ti3 precipitates in a Ni-Ti single crystal (CPCI-S收录) 会议论文 JOURNAL OF ALLOYS AND COMPOUNDS 作者:  Cao, S.[1,2];  Ke, C. B.[1];  Zhang, X. P.[1];  Schryvers, D.[2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Ni-Ti  Ni4Ti3 precipitates  FIB/SEM  3D reconstruction  Phase-field simulation   Phase field simulation of grain growth in Ti-6A1-4V during high temperature deformation (EI收录) 会议论文 Ti 2011 - Proceedings of the 12th World Conference on Titanium, Beijing, China, June 19, 2011 - June 24, 2011 作者:  Yang, M.[1];  Wang, G.[2];  Xu, D.S.[1];  Zhang, J.H.[1];  Teng, C.Y.[1,3] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Deformation  Phase interfaces  Strain   Evaluation of glass-forming ability for metallic melts by phase field approach (CPCI-S收录) 会议论文 MECHATRONICS AND INTELLIGENT MATERIALS II, PTS 1-6 作者:  Wang, Gang[1];  Zeng, Dechang[1];  Liu, Zhongwu[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Amorphous alloys  Glass-forming ability  Critical cooling rate  Phase field simulation   Phase Field Simulation of Grain Growth in Ti-6A1-4V during High Temperature Deformation (CPCI-S收录) 会议论文 TI-2011: PROCEEDINGS OF THE 12TH WORLD CONFERENCE ON TITANIUM, VOL I 作者:  Yang, M.[1];  Wang, G.[2];  Xu, D. S.[1];  Zhang, J. H.[1];  Teng, C. Y.[1,3] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 Strain  stored energy  grain growth  phase field simulation   The Twinning Modes of B2-B19 ' Martensitic Transformation in NiTi Alloys A Phase Field Study (CPCI-S收录) 会议论文 NEW MATERIALS, APPLICATIONS AND PROCESSES, PTS 1-3 作者:  Ke, Changbo[1];  Cao, Shanshan[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 Twinning mode  Martensitic transformation  NiTi alloys  Phase field simulation   Phase Field Simulation of Ni(4)Ti(3) Precipitation in Porous NiTi Shape Memory Alloys under Applied Stresses (CPCI-S收录) 会议论文 PRICM 7, PTS 1-3 作者:  Ke, Changbo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/16 Porous NiTi shape memory alloy  coherent precipitate  kinetics  phase field approach   Phase field simulation of Ni4Ti3 precipitation in porous NiTi shape memory alloys under applied stresses (EI收录) 会议论文 Materials Science Forum, Cairns, QLD, Australia, August 2, 2010 - August 6, 2010 作者:  Ke, Changbo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/16 Alloys  Precipitates  Shape memory effect