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A new method to improve the tribological performance of metal nitride coating: A case study for CrN coating 期刊论文
VACUUM, 2020, 卷号: 173
作者:  Zhang, Jingwen;  Li, Zechao;  Wang, Yongxin;  Zhou, Shengguo;  Wang, Yixuan
收藏  |  浏览/下载:124/0  |  提交时间:2020/12/16
Transient Soldering Reaction Mechanisms of SnCu Solder on CuNi Nano Conducting Layer and Fracture Behavior of the Joint Interfaces 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 卷号: 49, 期号: 5, 页码: 3383-3390
作者:  Zhang, Qingke;  Hu, Fangqin;  Song, Zhenlun
收藏  |  浏览/下载:114/0  |  提交时间:2020/12/16
SiC ceramics joined with an in-situ reaction gradient layer of TiC/Ti(3)SiC(2 )and interface stress distribution simulations 期刊论文
CERAMICS INTERNATIONAL, 2018, 卷号: 44, 期号: 13, 页码: 15785-15794
作者:  Huang, Qing;  Ding, Shurong;  Lee, Jaehyung;  Li, Peng;  Li, Youbing
收藏  |  浏览/下载:33/0  |  提交时间:2018/12/04
Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction 期刊论文
MATERIALS LETTERS, 2018, 卷号: 214, 页码: 142-145
作者:  Jiang, J. J.;  Hu, F. Q.;  Zhang, Q. K.;  Song, Z. L.
收藏  |  浏览/下载:19/0  |  提交时间:2018/12/04


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