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Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 8, 页码: 1305-1314
作者:  Gao, LY;  Zhang, H;  Li, CF;  Guo, JD;  Liu, ZQ
收藏  |  浏览/下载：29/0  |  提交时间：2018/12/25
Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 10, 页码: 8371-8379
作者:  Shi, QY;  Liu, ZQ;  Wu, D;  Zhang, H;  Ni, DR
收藏  |  浏览/下载：30/0  |  提交时间：2018/06/05
The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642
作者:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ
收藏  |  浏览/下载：24/0  |  提交时间：2018/06/05
Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033
作者:  Zhu, QS;  Gao, F
收藏  |  浏览/下载：20/0  |  提交时间：2018/06/05
The nucleation and growth mechanism of Ni-Sn eutectic in a single crystal superalloy 期刊论文
ELSEVIER SCIENCE BV, 2017, 卷号: 479, 页码: 75-82
作者:  Jiang, Weiguo;  Wang, Li;  Li, Xiangwei;  Lou, Langhong;  Jiang, WG (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
收藏  |  浏览/下载：215/0  |  提交时间：2018/01/10
Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder 期刊论文
MATERIALS, 2017, 卷号: 10, 期号: 5, 页码: -
Yang, Fan; Zhang, Liang; Liu, Zhi-quan; Zhong, Su Juan; Ma, Jia; Bao, Li
收藏  |  浏览/下载：24/0  |  提交时间：2017/08/17

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