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CORC

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A modified low-temperature wafer bonding method using spot pressing bonding technique and water glass adhesive layer 期刊论文
JAPANESE JOURNAL OF APPLIED PHYSICS, 2017
作者:  Chen DP(陈大鹏);  Wang YH(王英辉);  Wang SK(王盛凯);  Xu Y(徐杨)
收藏  |  浏览/下载：13/0  |  提交时间：2018/06/08
Iii-v chip preparation and integration in silicon photonics 专利
专利号: WO2017197132A1, 申请日期: 2017-11-16, 公开日期: 2017-11-16
作者:  LAMBERT, DAMIEN
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/31
Optical transceiver by fowlp and dop multichip integration 专利
专利号: US20170254968A1, 申请日期: 2017-09-07, 公开日期: 2017-09-07
作者:  DING, LIANG;  NAGARAJAN, RADHAKRISHNAN L.;  COCCIOLI, ROBERTO
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30
Dual bond pad structure for photonics 专利
专利号: US20170125973A1, 申请日期: 2017-05-04, 公开日期: 2017-05-04
作者:  GAMBINO, JEFFREY P.;  GRAF, RICHARD S.;  LEIDY, ROBERT K.;  MALING, JEFFREY C.
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/31
An electrical test method for quality detecting of wafer level eutetic bonding 期刊论文
Journal of Micromechanics and Microengineering, 2017
作者:  Zhang LM(张乐民);  Jiao BB(焦斌斌);  Kong YM(孔延梅);  Yun SC(云世昌);  Chen DP(陈大鹏)
收藏  |  浏览/下载：8/0  |  提交时间：2018/07/09
Thermally Reversible and Crosslinked Polyurethane based on Diels-Alder Chemistry for Ultrathin Wafer Temporary Bonding at Low-temperature 会议论文
Orlando，the USA
作者:  Jinhui Li;  Qiang Liu;  Guoping Zhang;  Bin Zhao;  Rong Sun
收藏  |  浏览/下载：21/0  |  提交时间：2018/02/02
Electron irradiation study of room-temperature wafer-bonded four junction solar cell grown by MBE 期刊论文
SOLAR ENERGY MATERIALS AND SOLAR CELLS, 2017, 卷号: 171, 期号: 11, 页码: 118-122
作者:  Dai, P (Dai, Pan);  Ji, L (Ji, Lian);  Tan, M (Tan, Ming);  Uchida, S (Uchida, Shiro);  Wu, YY (Wu, Yuanyuan)
收藏  |  浏览/下载：30/0  |  提交时间：2017/11/30
Solid-State-Diffusion Bonding for Wafer-Level Fine-Pitch Cu/Sn/Cu Interconnect in 3-D Integration 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2017, 卷号: 7, 页码: 19-26
作者:  Wang, Junqiang;  Wang, Qian;  Wu, Zijian;  Wang, Dejun;  Cai, Jian
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/02
DEVELOPMENT OF WAFER LEVEL HYBRID BONDING PROCESS USING PHOTOSENSITIVE ADHESIVE AND CU PILLAR BUMP 会议论文
China Semiconductor Technology International Conference (CSTIC), Shanghai, PEOPLES R CHINA, 2017-03-12
作者:  Yao, Mingjun;  Yu, Daquan;  Zhao, Ning;  Fan, Jun;  Xiao, Zhiyi
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
Simplified low-temperature wafer-level hybrid bonding using pillar bump and photosensitive adhesive for three-dimensional integrated circuit integration 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2017, 卷号: 28, 页码: 9091-9095
作者:  Yao, Mingjun;  Fan, Jun;  Zhao, Ning;  Xiao, Zhiyi;  Yu, Daquan
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/02

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