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Ethylene Vinyl Acetate Copolymer-Based High-Adhesion, Low-Cost and Superlyophobic Dry Adhesives 会议论文
Singapore, 2017
作者:  L. Yuan;  T. Peng;  Z. Wang;  T. Wu
收藏  |  浏览/下载:16/0  |  提交时间:2018/02/02
A low-melting-point alloy filled epoxy conductive adhesives as thermal interface materials 会议论文
Harbin, China
作者:  Jia-Hui Kang;  Jia-Li Sheng;  Xian-Zhu Fu;  Rong Sun;  Ching-Ping Wong
收藏  |  浏览/下载:15/0  |  提交时间:2018/02/02
Enhancement of thermal conductivity of epoxy adhesives by ball milling copper flakes 会议论文
Harbin, China
作者:  Lu Xu;  Hao-Ran Wen;  Futao Zhang;  Matthew M.F. Yuen;  Xian-Zhu Fu
收藏  |  浏览/下载:17/0  |  提交时间:2018/02/02


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