QQ客服 官方微博 反馈留言

	Enhancement of thermal conductivity of epoxy adhesives by ball milling copper flakes
	Lu Xu; Hao-Ran Wen; Futao Zhang; Matthew M.F. Yuen; Xian-Zhu Fu; Rong Sun; Ching-Ping Wong Wong
	2017
会议地点	Harbin, China
英文摘要	In this study, copper flake was synthesized through wet ball milling the copper micro sphere, which was used as the filler of epoxy adhesives. The effect of ball milling time and dispersant on morphology of copper have investigated. The effect of ball milling with oleic acid as dispersant is more homogeneous than alcohol. The longer ball milling time, the higher proportion of Cu flake. When ball milling time comes to 2 hours, the thermal conductivity of copper adhesive filled with as-prepared Cu flake comes to threshold. Moreover, permissible voltage of copper adhesive filled with as-prepared Cu flake is reduced. This research provides an efficient way to synthesis Cu micro flake, which can used as the filler of thermal interface materials with high thermal conductivity for integrated circuit packaging application.
语种	英语
内容类型	会议论文
源URL	[http://ir.siat.ac.cn:8080/handle/172644/11847]
专题	深圳先进技术研究院_集成所
作者单位	2017
推荐引用方式 GB/T 7714	Lu Xu,Hao-Ran Wen,Futao Zhang,et al. Enhancement of thermal conductivity of epoxy adhesives by ball milling copper flakes[C]. 见:. Harbin, China.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。