| A low-melting-point alloy filled epoxy conductive adhesives as thermal interface materials | |
| Jia-Hui Kang; Jia-Li Sheng; Xian-Zhu Fu; Rong Sun; Ching-Ping Wong | |
| 2017 | |
| 会议地点 | Harbin, China |
| 英文摘要 | In this paper, we reported the performances of epoxy conductive adhesives filled with a low-melting-point Sn-Bi-Ag alloy. Results revealed the excellent stability, mechanical property of the Sn-Bi-Ag epoxy adhesives. Meanwhile, the thermal conductivity increased by increasing the content of Sn-Bi-Ag filler and 18 W m−1 K−1 can be obtained with 85% Sn-Bi-Ag filler content. |
| 语种 | 英语 |
| 内容类型 | 会议论文 |
| 源URL | [http://ir.siat.ac.cn:8080/handle/172644/11849]  |
| 专题 | 深圳先进技术研究院_集成所 |
| 作者单位 | 2017 |
| 推荐引用方式 GB/T 7714 | Jia-Hui Kang,Jia-Li Sheng,Xian-Zhu Fu,et al. A low-melting-point alloy filled epoxy conductive adhesives as thermal interface materials[C]. 见:. Harbin, China. |
| 个性服务 |
| 查看访问统计 |
| 相关权益政策 |
| 暂无数据 |
| 收藏/分享 |
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。
修改评论