Design and Implementation of a Compact 3D Stacked RF Front-End Module for Micro Base Station

	Design and Implementation of a Compact 3D Stacked RF Front-End Module for Micro Base Station
	Wan LX(万里兮); Tian GX(田更新); Li J(李君); Hou FZ(侯峰泽); Zhang WW(张文雯); Guo XP(郭学平); Cao LQ(曹立强)
刊名	IEEE Transactions on Components Packaging and Manufacturing Technology
	2018-05-19
文献子类	期刊论文
内容类型	期刊论文
源URL	[http://159.226.55.107/handle/172511/19056]
专题	微电子研究所_系统封装与集成研发中心
作者单位	中国科学院微电子研究所
推荐引用方式 GB/T 7714	Wan LX,Tian GX,Li J,et al. Design and Implementation of a Compact 3D Stacked RF Front-End Module for Micro Base Station[J]. IEEE Transactions on Components Packaging and Manufacturing Technology,2018.
APA	Wan LX.,Tian GX.,Li J.,Hou FZ.,Zhang WW.,...&Cao LQ.(2018).Design and Implementation of a Compact 3D Stacked RF Front-End Module for Micro Base Station.IEEE Transactions on Components Packaging and Manufacturing Technology.
MLA	Wan LX,et al."Design and Implementation of a Compact 3D Stacked RF Front-End Module for Micro Base Station".IEEE Transactions on Components Packaging and Manufacturing Technology (2018).