CORC

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CORC

浏览/检索结果: 共23条，第1-10条 帮助

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Theoretical and experimental investigation of highly photocatalytic performance of CuInZnS nanoporous structure for removing the NO gas 期刊论文
2018, 卷号: 357, 页码: 100-107
作者:  Ye, Ying[1];  Zang, Zhigang[1];  Zhou, Tingwei[1];  Dong, Fan[3];  Lu, Shirong[2]
收藏  |  浏览/下载：65/0  |  提交时间：2019/11/28
Eliminating J-V hysteresis in perovskite solar cells via defect controlling 期刊论文
2018, 卷号: 58, 页码: 283-289
作者:  Chen, Wei[1,2];  Sun, Kuan[1];  Ma, Chaoyan[2];  Leng, Chongqian[2];  Fua, Jiehao[1,2]
收藏  |  浏览/下载：6/0  |  提交时间：2019/11/28
Copper thiocyanate/copper iodide based hole transport composites with balanced properties for efficient polymer light-emitting diodes 期刊论文
2018, 卷号: 6, 页码: 4895-4902
作者:  Luo, Wei[1,2];  Zeng, Chao[1,2];  Du, Xiaoqing[1];  Leng, Chongqian[2];  Yao, Wei[2]
收藏  |  浏览/下载：9/0  |  提交时间：2019/11/28
Ultraflexible and High-Performance Multilayer Transparent Electrode Based on ZnO/Ag/CuSCN 期刊论文
2018, 卷号: 10, 页码: 9571-9578
作者:  Ji, Yixiong[1];  Yang, Jun[1];  Luo, Wei[1];  Tang, Linlong[1];  Bai, Xiangxing[1]
收藏  |  浏览/下载：9/0  |  提交时间：2019/11/30
The role of hydrogen bonding in bulk-heterojunction (BHJ) solar cells: A review 期刊论文
2018, 卷号: 182, 页码: 1-13
作者:  Xiao, Zeyun[1]
收藏  |  浏览/下载：3/0  |  提交时间：2019/11/30
The influence of sintering process on thermal properties of nano-silver paste 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Lu, Xiuzhen[1];  Zhang, Qianran[2];  Zehri, Abdelhafid[3];  Ke, Wei[4];  Huang, Shirong[5]
收藏  |  浏览/下载：15/0  |  提交时间：2019/04/22
Conductivity Enhancement of PEDOT:PSS via Addition of Chloroplatinic Acid and Its Mechanism 期刊论文
2017, 卷号: 3
作者:  Wu, Falin[1];  Li, Pengcheng[2];  Sun, Kuan[1];  Zhou, Yongli[1];  Chen, Wei[1,3]
收藏  |  浏览/下载：5/0  |  提交时间：2019/11/28
Performance improvement of perovskite solar cells by employing a CdSe quantum dot/PCBM composite as an electron transport layer 期刊论文
2017, 卷号: 5, 页码: 17499-17505
作者:  Zeng, Xiaofeng[1];  Zhou, Tingwei[1];  Leng, Chongqian[2];  Zang, Zhigang[1];  Wang, Ming[1]
收藏  |  浏览/下载：4/0  |  提交时间：2019/11/28
An Overview of Carbon Nanotubes Based Interconnects for Microelectronic Packaging 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Chen, Shujing[1];  Shan, Bo[2];  Yang, Yiqun[3];  Yuan, Guangjie[4];  Huang, Shirong[5]
收藏  |  浏览/下载：17/0  |  提交时间：2019/04/24
Improved Reliability of Electrically Conductive Adhesives Joints on Cu-Plated PCB Substrate Enhanced by Graphene Protection Barrier 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Huang, Shirong[1];  Ke, Wei[2];  Yang, Yiqun[3];  Ye, Hui[4];  Chen, Shujing[5]
收藏  |  浏览/下载：41/0  |  提交时间：2019/04/24

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