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A New Model for Deriving the Priority Weights from Hesitant Triangular Fuzzy Preference Relations
期刊论文
Mathematical Problems in Engineering, 2019, 卷号: 2019, 期号: 1, 页码: 1-12
作者:
Liu, Yuan
;
Shen, Gongtian*
;
Zhao, Zhangyan
;
Wu, Zhanwen
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/12/04
A new model for deriving the priority weights from hesitant triangular fuzzy preference relations (Open Access)
期刊论文
Mathematical Problems in Engineering, 2019, 卷号: 2019
作者:
Liu, Yuan
;
Shen, Gongtian
;
Zhao, Zhangyan
;
Wu, Zhanwen
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/05
Effect of eddy current inducted heating on optical property and thermostability of high power LED
期刊论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, 页码: 819-822
作者:
Chen, Jibing*
;
Wan, Nong
;
Li, Juying
;
He, Zhanwen
;
Wu, Yiping
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/12/27
High-power LED
Microstructure
Proformance Thermal Fatigue
Reliability
Effect of rapid inducted heating on the microstructure of solder joint in IC
会议论文
19th International Conference on Electronic Packaging Technology (ICEPT), Inst Microelectron Chinese Acad Sci, Shanghai, PEOPLES R CHINA, AUG 08-11, 2018
作者:
Chen, Jibing*
;
Wan, Nong
;
Li, Juying
;
He, Zhanwen
;
Wu, Yiping
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/27
lead-free joint
rapid thermal cycling
microstructure
IMC
electronic packaging
Phase engineering of cobalt hydroxides using magnetic fields for enhanced supercapacitor performance
期刊论文
JOURNAL OF MATERIALS CHEMISTRY A, 2017, 卷号: 5, 期号: 36, 页码: 19203-19209
作者:
Dai, Peng
;
Yan, Taotao
;
Hu, Lin
;
Pang, Zhanwen
;
Bao, Zhiwei
收藏
  |  
浏览/下载:23/0
  |  
提交时间:2018/08/16
Phase engineering of cobalt hydroxides using magnetic fields for enhanced supercapacitor performance
期刊论文
JOURNAL OF MATERIALS CHEMISTRY A, 2017, 卷号: 5, 期号: 36, 页码: 19203-19209
作者:
Peng Dai
;
Taotao Yan
;
Lin Hu
;
Zhanwen Pang
;
Zhiwei Bao
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2018/10/18
Research on microstructures of double interfaces SAC305 solder joint by RPC
会议论文
18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Harbin, PEOPLES R CHINA, AUG 16-19, 2017
作者:
Chen, Jibing*
;
Wan, Nong
;
Li, Juying
;
He, Zhanwen
;
Wu, Yiping
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2019/12/27
lead-free joint
rapid thermal cycling
microstructure
IMC
electronic packaging
Performances and microstructures of a high-power LED based on rapid thermal cycling
会议论文
18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Harbin, PEOPLES R CHINA, AUG 16-19, 2017
作者:
Chen, Jibing*
;
Wan, Nong
;
Li, Juying
;
He, Zhanwen
;
Wu, Yiping
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/27
High-power LED
Microstructure
Proformance Thermal Fatigue
Reliability
A comparative study of properties and microstructures on thermal fatigue testing of a High-power LED
会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, AUG 16-19, 2016
作者:
Chen, Jibing*
;
Wan, Nong
;
Li, Juying
;
He, Zhanwen
;
Wu, Yiping
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2019/12/27
High-power LED
Microstructure
Property
Thermal Fatigue
Reliability
Study on thermal fatigue characteristics of lead-free SAC305 solder joint by RPC
会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, AUG 16-19, 2016
作者:
Chen, Jibing*
;
Wan, Nang
;
Li, Juying
;
He, Zhanwen
;
Wu, Yiping
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/27
lead-free joint
rapid thermal cycle
solder joint
microstructure
IMC
electronic packaging
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