CORC

浏览/检索结果: 共1条,第1-1条 帮助

限定条件                
已选(0)清除 条数/页:   排序方式:
Investigation on the Properties and Processability of Polymeric Insulation Layers for Through Silicon Via 会议论文
2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013, Las Vegas, NV, United states
作者:  Zhao Songfang;  Zhang Guoping;  Peng Chongnan;  Sun Rong;  Lee S. W. Ricky
收藏  |  浏览/下载:42/0  |  提交时间:2015/08/27


©版权所有 ©2017 CSpace - Powered by CSpace