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	Investigation on the Properties and Processability of Polymeric Insulation Layers for Through Silicon Via
	Zhao Songfang; Zhang Guoping; Peng Chongnan; Sun Rong; Lee S. W. Ricky; Zhu Wenhui; Lai Fangqi
	2013
会议名称	2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
会议地点	Las Vegas, NV, United states
英文摘要	3D packaging using through silicon via (TSV) technology is becoming important in IC packaging industry. In this paper, the TSV process uses a polymeric liner as insulation material and a buffer for thermo-mechanical stress relaxation. Fourier transform infrared spectroscopy (FTIR), thermogravimetry analysis (TGA), differential scanning calorimetry (DSC), dielectric and contact angle tests are applied to select a suitable dielectric from two kinds of polymers. All the properties show that the linear o-crosel phenolic (LOPF) is suitable for acting as an insulation liner in the TSV process. Then the LOPF liquid is spun on the wafer, followed by soft baking at the temperature of 115 °C, the processed wafer is inspected using optical microscope, step profiler and scanning electron microscope (SEM). All the results indicate that LOPF has good potential to be the insulation layers for TSV.
收录类别	EI
语种	英语
内容类型	会议论文
源URL	[http://ir.siat.ac.cn:8080/handle/172644/4579]
专题	深圳先进技术研究院_集成所
作者单位	2013
推荐引用方式 GB/T 7714	Zhao Songfang,Zhang Guoping,Peng Chongnan,et al. Investigation on the Properties and Processability of Polymeric Insulation Layers for Through Silicon Via[C]. 见:2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013. Las Vegas, NV, United states.

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