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Sorption mechanisms of sulfamethazine to soil humin and its subfractions after sequential treatments 期刊论文
ENVIRONMENTAL POLLUTION, 2017
Guo, Xiaoying; Shen, Xiaofang; Zhang, Meng; Zhang, Haiyun; Chen, Weixiao; Wang, Hui; Koelmans, A. A.; Cornelissen, Gerard; Tao, Shu; Wang, Xilong
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
MEMS硅玻璃阳极键合工艺评价方法 期刊论文
传感器与微系统, 2017
谷专元; 何春华; 何燕华; 赵前程; 张大成
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Influence of remaining tooth structure and restorative material type on stress distribution in endodontically treated maxillary premolars: A finite element analysis 期刊论文
JOURNAL OF PROSTHETIC DENTISTRY, 2017
Zhu, Junxin; Rong, Qiguo; Wang, Xiaoyan; Gao, Xuejun
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Stand-alone differential capacitance force sensors with sub-nano-newton sensitivity 期刊论文
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2017
Ye, Jilong; Sun, Taotao; Huang, Dong; Li, Zhihong; Lin, Li
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Investigations of silicon wafer bonding utilizing sputtered Al and Sn films 期刊论文
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2017
Zhu, Zhiyuan; Yu, Min; Jin, Yufeng
收藏  |  浏览/下载：1/0  |  提交时间：2017/12/03
DEVICES  MEMS  
Radiation preparation of graphene/carbon nanotubes hybrid fillers for mechanical reinforcement of poly(vinyl alcohol) films 期刊论文
RADIATION PHYSICS AND CHEMISTRY, 2016
Ma, Hui-Ling; Zhang, Long; Zhang, Youwei; Wang, Shuojue; Sun, Chao; Yu, Hongyan; Zeng, Xinmiao; Zhai, Maolin
收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03
Hubbard interactions in iron-based pnictides and chalcogenides: Slater parametrization, screening channels, and frequency dependence 期刊论文
PHYSICAL REVIEW B, 2016
van Roekeghem, Ambroise; Vaugier, Loig; Jiang, Hong; Biermann, Silke
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Assembly and Reassembly of Polyelectrolyte Complex Formed by Poly(ethylene glycol)-block-poly(glutamate sodium) and S5R4 Peptide 期刊论文
MACROMOLECULES, 2016
Wen, Hao; Zhou, Jihan; Pan, Wei; Li, Zhibo; Liang, Dehai
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/04
Fabrication, Characterization, and Simulation of a Low-Cost TSV Integration Without Front-Side CMP Process 期刊论文
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2016
Guan, Yong; Zhu, Yunhui; Ma, Shenglin; Zeng, Qinghua; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Process Development of a New TGV Interposer for Wafer Level Package of Inertial MEMS Device 其他
2016-01-01
Ma, Shenglin; Ren, Kuili; Xia, Yanming; Yan, Jun; Luo, Rongfeng; Cai, Han; Jin, Yufeng; Ma, Mingjun; Jin, Zhonghe; Chen, Jing
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03

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