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浏览/检索结果: 共7条，第1-7条 帮助 限定条件 发表日期：2018     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Subwavelength interference of light on structured surfaces 期刊论文 ADVANCES IN OPTICS AND PHOTONICS, 2018, 卷号: 10, 期号: 4, 页码: 757-842 作者:  XIANGANG LUO 收藏  |  浏览/下载：68/0  |  提交时间：2019/08/23 A succinct method to generate multi-type HCV beams with a spatial spiral varying retardation-plate 期刊论文 EPL, 2018, 卷号: 121, 期号: 5, 页码: 5 作者:  Qi, Junli;  Zhang, Hui;  Pan, Baoguo;  Deng, Haifei;  Yang, Jinhong 收藏  |  浏览/下载：51/0  |  提交时间：2019/08/23 Analysis on stability of polarization-transforming performance of fiber wave plate 期刊论文 OPTIK, 2018, 卷号: 157, 页码: 1249-1258 作者:  Wang, Lihui[1];  Shi, Zhidong[2];  Tang, Sisi[3];  Zhang, Haiyan[4] 收藏  |  浏览/下载：13/0  |  提交时间：2019/04/24 Birefringence fiber  Quarter wave plate  Beat length  Phase retardation  Thermal stability  Achromatic performance   Analysis on Performance Stability of Spun Fiber Wave Plate 会议论文 SIXTH INTERNATIONAL CONFERENCE ON OPTICAL AND PHOTONIC ENGINEERING (ICOPEN 2018), 2018-01-01 作者:  Wang, Lihui[1];  Shi, Zhidong[2];  Tang, Sisi[3];  Zhang, Haiyan[4] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/22 birefringence fiber  quarter wave plate  beat length  phase retardation  performance stability   Analysis on Achromatic Performance of Spun Fiber Wave Plate 会议论文 SIXTH INTERNATIONAL CONFERENCE ON OPTICAL AND PHOTONIC ENGINEERING (ICOPEN 2018), 2018-01-01 作者:  Ma, Yiming[1];  Shi, Zhidong[2];  Wang, Lihui[3];  Tang, Sisi[4] 收藏  |  浏览/下载：9/0  |  提交时间：2019/04/22 birefringence fiber  beat length  quarter wave plate  phase retardation  achromatic performance   Analysis on Thermal Stability of Spun Fiber Wave Plate 会议论文 SIXTH INTERNATIONAL CONFERENCE ON OPTICAL AND PHOTONIC ENGINEERING (ICOPEN 2018), 2018-01-01 作者:  Tang, Sisi[1];  Shi, Zhidong[2];  Wang, Lihui[3];  Zhang, Haiyan[4] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/22 birefringence fiber  quarter wave plate  beat length  phase retardation  thermal stability   Development of Auto Infrared Photoelastic Microscope for Stress Measurement of Silicon 会议论文 Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018 作者:  Li, T.;  Yao, R.;  Yu, C.;  Su, F. 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/30 Cracks  Elasticity  Electronics packaging  Light polarization  Microscopes  Optical devices  Silicon carbide  Silicon wafers  Stresses  Wafer bonding  Wide band gap semiconductors  Electronic Packaging  Heating platform  Phase difference  Quarter wave-plate  Si-based materials  Silicon-based materials  Stress birefringence  Temperature cycling tests  Three dimensional integrated circuits