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CORC

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Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 2872-2887
作者:  Shang, Shengyan;  Kunwar, Anil;  Wang, Yanfeng;  Qu, Lin;  Ma, Haitao
收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02
Geometrical Effects of Cu@Ag Core-Shell Nanoparticles Treated Flux on the Growth Behaviour of Intermetallics in Sn/Cu Solder Joints 期刊论文
ELECTRONIC MATERIALS LETTERS, 2019, 卷号: 15, 页码: 253-265
作者:  Shang, Shengyan;  Kunwar, Anil;  Wang, Yanfeng;  Yao, Jinye;  Wu, Yingchao
收藏  |  浏览/下载：29/0  |  提交时间：2019/12/02
Acid-tolerant intermetallic cobalt-nickel silicides as noble metal-like catalysts for selective hydrogenation of phthalic anhydride to phthalide 期刊论文
CATALYSIS SCIENCE & TECHNOLOGY, 2019, 卷号: 9, 页码: 1108-1116
作者:  Zhang, Liangliang;  Chen, Xiao;  Chen, Yujing;  Peng, Zhijian;  Liang, Changhai
收藏  |  浏览/下载：31/0  |  提交时间：2019/12/02
Effect of the TiO2 Nanoparticles on the Growth Behavior of Intermetallics in Sn/Cu Solder Joints 期刊论文
METALS AND MATERIALS INTERNATIONAL, 2019, 卷号: 25, 页码: 499-507
作者:  Shang, Shengyan;  Kunwar, Anil;  Yao, Jinye;  Wang, Yanfeng;  Ma, Haitao
收藏  |  浏览/下载：27/0  |  提交时间：2019/12/02
Evolution behavior and growth kinetics of intermetallic compounds at Sn/Cu interface during multiple reflows 期刊论文
INTERMETALLICS, 2018, 卷号: 96, 页码: 1-12
作者:  Ma, H. R.;  Kunwar, A.;  Shang, S. Y.;  Jiang, C. R.;  Wang, Y. P.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling 期刊论文
INTERMETALLICS, 2018, 卷号: 93, 页码: 186-196
作者:  Kunwar, Anil;  Guo, Bingfeng;  Shang, Shengyan;  Raback, Peter;  Wang, Yunpeng
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
In situ observation on the solidification of Sn-10Cu hyperperitectic alloy under direct current field by synchrotron microradiography 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 721, 页码: 126-133
作者:  Xuan, Zhenjing;  Mao, Feng;  Cao, Zhiqiang
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Effect of ultrasonic treatment on formation of iron-containing intermetallic compounds in Al-Si alloys 期刊论文
CHINA FOUNDRY, 2016, 卷号: 13, 页码: 316-321
作者:  Zhang, Yu-bo;  Kateryna, Svynarenko;  Li, Ting-ju
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09
Dominant effect of high anisotropy in beta-Sn grain on electromigration-induced failure mechanism in Sn-3.0Ag-0.5Cu interconnect 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2016, 卷号: 678, 页码: 370-374
作者:  Huang, M. L.;  Zhao, J. F.;  Zhang, Z. J.;  Zhao, N.
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/09
Synchrotron radiation real-time in situ study on dissolution and precipitation of Ag3Sn plates in sub-50 mu m Sn-Ag-Cu solder bumps 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2014, 卷号: 602, 页码: 281-284
作者:  Huang, M. L.;  Yang, F.;  Zhao, N.;  Yang, Y. C.
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09

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