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Effects of yttrium on wettability and interactions between molten superalloy and SiO2-based ceramic core 会议论文
作者:  Zi, Yun;  Meng, Jie;  Zou, Mingke;  Xu, Wei;  Li, Jinguo
收藏  |  浏览/下载：6/0  |  提交时间：2020/12/18
Catalytic Reactions at the metal-oxide interface:interface and size effects 会议论文
北京, 2017-08-29
作者:  Yang F(杨帆)
收藏  |  浏览/下载：6/0  |  提交时间：2017/10/29
Microstructure and interfacial reactions of Sn-Au-Ag solder joints on Cu and Ni substrates 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Chen, Y.;  Huang, M. L.;  Zhao, N.
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09
Using electrochemistry - Total internal refection imaging ellipsometry to monitor biochemical oxygen demand on the surface tethered polyelectrolyte modified electrode 会议论文
1st Conference on Quantitative Phase Imaging, QPI 2015，Progress in Biomedical Optics and Imaging - Proceedings of SPIE, San Francisco, CA, United states, February 7, 2015 - February 10, 2015
作者:  Liu W(刘巍);  Li M(李萌);  Lv BE;  Chen YY(陈艳艳);  Ma HW
收藏  |  浏览/下载：22/0  |  提交时间：2016/06/21
Squeeze cast co-continuous ALN/AL composites 会议论文
作者:  Lu, Yuan;  Li, Jing Long;  Yang, Jian Feng;  Jing, Qiang Zheng;  Li, Jing Jing
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
Interface-Confined Oxide Nanostructures for Catalytic Oxidation Reactions 会议论文
the 15th asian chemical congress, 新加坡, 41505
包信和
收藏  |  浏览/下载：14/0  |  提交时间：2014/09/11
Interfacial reaction thermodynamics between Sn-Cu-Ag solder and Ni substrate 会议论文
Xu, Hong Yan; Wu, Hu; Xu, Bing Sheng; Wu, Yan
收藏  |  浏览/下载：2/0  |  提交时间：2015/11/13
Analyses of connected interface area by pulsed DE-MIG brazing-welding for aluminum-steel dissimilar metals 会议论文
Singapore, February 20, 2013 - February 21, 2013
作者:  Gu, Yu Fen;  Shao, Ling;  Shi, Yu;  Huang, Jian Kang
收藏  |  浏览/下载：11/0  |  提交时间：2020/11/15
Surface morphology and interface reaction of Cu/SiO2/Si (111) systems prepared by radio frequency magnetron sputtering 会议论文
2012 International Conference on Emerging Materials and Mechanics Applications, ICEMMA 2012, Hangzhou, China, February 5, 2012 - February 6, 2012
作者:  Cao, Bo;  Yang, Tongrui;  Li, Gongping
收藏  |  浏览/下载：5/0  |  提交时间：2017/01/20
The study on the rapidly-solidified Sn-0.7Cu lead-free solders and the interface reactions with Cu substrate 会议论文
13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, PEOPLES R CHINA, 2012-01-01
作者:  Ma, H. T.;  Wang, J.;  Qu, L.;  An, L. L.;  Gu, L. Y.
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/13

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