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Effect of thermal stress on the electrical properties of TSV inductor 会议论文
2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019-01-01
作者:  Wang, Fengjuan;  Liu, Jingting;  Yu, Ningmei
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/20
Electrical Resistivity Model for SSTA of Cu Nanowires 会议论文
2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019-01-01
作者:  Li, Jianwei;  Dai, Li;  Yu, Ningmei
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/20
Complex electrical resistivity properties of seafloor polymetallic sulfides in SWIR 会议论文
88th Society of Exploration Geophysicists International Exposition and Annual Meeting, SEG 2018, Anaheim, CA, United states, 2018-10-14
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收藏  |  浏览/下载：3/0  |  提交时间：2020/01/03
Influence of the morphology of alumina filler on electrical and thermal properties of epoxy resin composites 会议论文
作者:  Ma, Jiawei;  Gao, Naikui;  Ren, Tengyue;  Pan, Zehua;  Jin, Haiyun
收藏  |  浏览/下载：5/0  |  提交时间：2019/11/19
Preparation and influencing factors of molybdenum targets and magnetron-sputter-deposited molybdenum thin films 会议论文
作者:  An, Geng;  Sun, Jun;  Sun, Yuan Jun;  Cao, Wei Cheng
收藏  |  浏览/下载：12/0  |  提交时间：2019/11/19
A low cost method to synthesize silver nanoparticles for the screen printing conductive inks 会议论文
Harbin, China
作者:  Zhuang Wang;  Tao Zhao;  Xiangwen Liang;  PengLi Zhu;  Rong Sun
收藏  |  浏览/下载：19/0  |  提交时间：2018/02/02
The Effect of Slime Pulp on Electrical Properties of Insulation Pressboard 会议论文
作者:  Liu, Lilan;  Tian, Huidong;  Zhao, Fuping;  Shi, Ran;  Peng, Zongren
收藏  |  浏览/下载：8/0  |  提交时间：2019/11/26
Effect of the beta-crystal formation in isotactic polypropylene used for eco-friendly insulating material 会议论文
作者:  Zhang, Wei;  Xu, Man;  He, Ming-Xuan;  Chen, George;  Hou, Shuai
收藏  |  浏览/下载：2/0  |  提交时间：2019/11/26
Piezoresistivity of Polyethylene Terephthalate Nickel Powder Composite 会议论文
4th Annual International Conference on Material Science and Environmental Engineering (MSEE), DEC 16-18, 2016
作者:  Zhang, Xiao-Meng;  Yao, Zhan-Yong;  Yu, Teng-Hai;  Zhang, Shuo
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/31
Preparation of highly conductive adhesives by in-stiu incorporation of silver nanoparticles 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:  Yankang Han;  Baotan Zhang;  Pengli Zhu;  Shulei Huang;  Qianqian Liu
收藏  |  浏览/下载：32/0  |  提交时间：2017/01/15

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