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Electro-wetting enhanced bonding strength 期刊论文
2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11.2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11, 2011, 页码: 858-861
Cheng, Rong; Jiang, Kewei; Li,XX
收藏  |  浏览/下载：5/0  |  提交时间：2012/08/23
Enhanced solder joint bonding strength of electronic packaging with electrowetting effect 期刊论文
MICROELECTRONIC ENGINEERING, 2011, 卷号: 88, 期号: 11, 页码: 3244-3248
Cheng,R; Jiang,KW; Li,XX
收藏  |  浏览/下载：10/0  |  提交时间：2012/04/12
Electro-wetting enhanced bonding strength 期刊论文
2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11.2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11, 2011, 页码: 858-861
Cheng, Rong; Jiang, Kewei; Li,XX
收藏  |  浏览/下载：9/0  |  提交时间：2012/08/23
ELECTRO-WETTING ENHANCED BONDING STRENGTH 会议论文
Transducers’11:The 16th International Conference on Solid-State Sensors, Actuators and Microsystems, 2011
Rong Cheng, Kewei Jiang, Xinxin Li
收藏  |  浏览/下载：7/0  |  提交时间：2012/05/04
The Bond Strength of Au/Si Eutectic Bonding Studied by IR Microscope 期刊论文
IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2010, 卷号: 33, 期号: 1, 页码: 31-37
Jing, ER; Xiong, B; Wang, YL
收藏  |  浏览/下载：10/0  |  提交时间：2011/12/17
The Bond Strength of Au/Si Eutectic Bonding Studied by IR Microscope 期刊论文
IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2010, 卷号: 33, 期号: 1 Pages, 页码: 31-37
Jing, ER; Xiong, B; Wang, YL
收藏  |  浏览/下载：16/0  |  提交时间：2012/05/12
The Bond Strength of Au/Si Eutectic Bonding Studied by IR Microscope 期刊论文
Source: IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2010, 卷号: 33, 期号: 1, 页码: 31-37
Author(s): Jing, ER (Jing, Errong); Xiong, B (Xiong, Bin); Wang, YL (Wang, Yuelin)
收藏  |  浏览/下载：14/0  |  提交时间：2012/05/12
Integrated microfluidic chip for endothelial cells culture and analysis exposed to a pulsatile and oscillatory shear stress 期刊论文
LAB ON A CHIP, 2009, 卷号: 9, 期号: 21, 页码: 3118-3125
Shao, JB; Wu, L; Wu, JZ; Zheng, YH; Zhao, H; Jin, QH; Zhao, JL
收藏  |  浏览/下载：14/0  |  提交时间：2011/12/17
Effect of interfacial reactions on the reliability of lead-free assemblies after board level drop tests 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2007, 卷号: 36, 期号: 9, 页码: 1129-1136
Xia, Y; Lu, C; Xle, X
收藏  |  浏览/下载：13/0  |  提交时间：2012/03/24
Interaction of intermetallic compound formation in Cu/SnAgCu/NiAu sandwich solder joints 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2006, 卷号: 35, 期号: 5, 页码: 897-904
Xia, YH; Lu, CY; Chang, JL; Xie, XM
收藏  |  浏览/下载：15/0  |  提交时间：2012/03/24

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