Enhanced solder joint bonding strength of electronic packaging with electrowetting effect

	Enhanced solder joint bonding strength of electronic packaging with electrowetting effect
	Cheng,R ; Jiang,KW ; Li,XX
刊名	MICROELECTRONIC ENGINEERING
	2011
卷号	88 期号:11 页码:3244-3248
关键词	ELSEVIER SCIENCE BV
ISSN号	0167-9317
学科主题	Engineering ; Electrical & Electronic; Nanoscience & Nanotechnology; Optics; Physics ; Applied
公开日期	2012-04-12
内容类型	期刊论文
源URL	[http://ir.sim.ac.cn/handle/331004/106888]
专题	上海微系统与信息技术研究所_微系统技术_期刊论文
推荐引用方式 GB/T 7714	Cheng,R,Jiang,KW,Li,XX. Enhanced solder joint bonding strength of electronic packaging with electrowetting effect[J]. MICROELECTRONIC ENGINEERING,2011,88(11):3244-3248.
APA	Cheng,R,Jiang,KW,&Li,XX.(2011).Enhanced solder joint bonding strength of electronic packaging with electrowetting effect.MICROELECTRONIC ENGINEERING,88(11),3244-3248.
MLA	Cheng,R,et al."Enhanced solder joint bonding strength of electronic packaging with electrowetting effect".MICROELECTRONIC ENGINEERING 88.11(2011):3244-3248.