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A powerful way of cooling computer chip using liquid metal with low melting point as the cooling fluid 期刊论文
Forschung im ingenieurwesen-engineering research, 2006, 卷号: 70, 期号: 4, 页码: 243-251
作者:  Li, Teng;  Lv, Yong-Gang;  Liu, Jing;  Zhou, Yi-Xin
收藏  |  浏览/下载:29/0  |  提交时间:2019/05/10
The parametric optimum design of a new combined system of semiconductor thermoelectric devices 期刊论文
http://dx.doi.org/10.1016/j.apenergy.2005.06.005, 2006
Chen, X. H.; Lin, B. H.; Chen, J. C.; 林比宏
收藏  |  浏览/下载:3/0  |  提交时间:2013/12/12
The parametric optimum design of a new combined system of semiconductor thermoelectric devices 期刊论文
http://dx.doi.org/10.1016/j.apenergy.2005.06.005, 2006
Chen, X. H.; Lin, B. H.; Chen, J. C.; 陈金灿
收藏  |  浏览/下载:1/0  |  提交时间:2013/12/12
Cooling of high power density devices using electrically conducting fluids 专利
专利号: WO2006025852A2, 申请日期: 2006-03-09, 公开日期: 2006-03-09
作者:  MINER, ANDREW, CARL;  GHOSHAL, UTTAM
收藏  |  浏览/下载:12/0  |  提交时间:2019/12/30
Cooling of high power density devices using electrically conducting fluids 专利
专利号: WO2006025852A2, 申请日期: 2006-03-09, 公开日期: 2006-03-09
作者:  MINER, ANDREW, CARL;  GHOSHAL, UTTAM
收藏  |  浏览/下载:12/0  |  提交时间:2019/12/30


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