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	A powerful way of cooling computer chip using liquid metal with low melting point as the cooling fluid
	Li, Teng; Lv, Yong-Gang; Liu, Jing; Zhou, Yi-Xin
刊名	Forschung im ingenieurwesen-engineering research
	2006-12-01
卷号	70期号:4页码:243-251
ISSN号	0015-7899
DOI	10.1007/s10010-006-0037-1
通讯作者	Liu, jing(jliu@cl.cryo.ac.cn)
英文摘要	With the improvement of computational speed, thermal management becomes a serious concern in computer system. cpu chips are squeezing into tighter and tighter spaces with no more room for heat to escape. total power-dissipation levels now reside about 110 w, and peak power densities are reaching 400-500 w/mm(2) and are still steadily climbing. as a result, higher performance and greater reliability are extremely tough to attain. but since the standard conduction and forced-air convection techniques no longer be able to provide adequate cooling for sophisticated electronic systems, new solutions are being looked into liquid cooling, thermoelectric cooling, heat pipes, and vapor chambers. in this paper, we investigated a novel method to significantly lower the chip temperature using liquid metal with low melting point as the cooling fluid. the liquid gallium was particularly adopted to test the feasibility of this cooling approach, due to its low melting point at 29.7 degrees c. high thermal conductivity and heat capacity. a series of experiments with different flow rates and heat dissipation rates were performed. the cooling capacity and reliability of the liquid metal were compared with that of the water-cooling and very attractive results were obtained. finally, a general criterion was introduced to evaluate the cooling performance difference between the liquid metal cooling and the water-cooling. the results indicate that the temperature of the computer chip can be significantly reduced with the increasing flow rate of liquid gallium, which suggests that an even higher power dissipation density can be achieved with a large flow of liquid gallium and large area of heat dissipation. the concept discussed in this paper is expected to provide a powerful cooling strategy for the notebook pc, desktop pc and large computer. it can also be extended to more wide area involved with thermal management on high heat generation rate.
WOS关键词	GALLIUM
WOS研究方向	Engineering
WOS类目	Engineering, Multidisciplinary ; Engineering, Mechanical
语种	英语
出版者	SPRINGER HEIDELBERG
WOS记录号	WOS:000243073400007
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2378495
专题	中国科学院大学
通讯作者	Liu, Jing
作者单位	1.Chinese Acad Sci, Tech Inst Phys & Chem, Cryogen Lab, Beijing 100080, Peoples R China 2.Chinese Acad Sci, Grad Sch, Beijing 100039, Peoples R China
推荐引用方式 GB/T 7714	Li, Teng,Lv, Yong-Gang,Liu, Jing,et al. A powerful way of cooling computer chip using liquid metal with low melting point as the cooling fluid[J]. Forschung im ingenieurwesen-engineering research,2006,70(4):243-251.
APA	Li, Teng,Lv, Yong-Gang,Liu, Jing,&Zhou, Yi-Xin.(2006).A powerful way of cooling computer chip using liquid metal with low melting point as the cooling fluid.Forschung im ingenieurwesen-engineering research,70(4),243-251.
MLA	Li, Teng,et al."A powerful way of cooling computer chip using liquid metal with low melting point as the cooling fluid".Forschung im ingenieurwesen-engineering research 70.4(2006):243-251.

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