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CORC

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Crack-free inalgan quaternary alloy films grown on si(111) substrate by metalorganic chemical vapor deposition 期刊论文
Journal of crystal growth, 2004, 卷号: 273, 期号: 1-2, 页码: 79-85
作者:  Wu, JJ;  Li, DB;  Lu, Y;  Han, XX;  Li, JM
收藏  |  浏览/下载：31/0  |  提交时间：2019/05/12
Effect of strain rate on the tensile properties of Sn-9Zn eutectic alloy 期刊论文
ACTA METALLURGICA SINICA, 2004, 卷号: 40, 期号: 11, 页码: 1151-1154
作者:  Zhang, L;  Xian, AP;  Wang, ZG;  Han, EH;  Shang, JK
收藏  |  浏览/下载：2/0  |  提交时间：2021/02/02
Effect of cyclic deformation on room temperature tensile behaviors of ultrafine grained copper 期刊论文
ACTA METALLURGICA SINICA, 2004, 卷号: 40, 期号: 11, 页码: 1165-1169
作者:  Huang, CX;  Wu, SD;  Li, GY;  Liu, T;  Jiang, CB
收藏  |  浏览/下载：3/0  |  提交时间：2021/02/02
Growth of crack-free gan films on si(111) substrate by using al-rich aln buffer layer 期刊论文
Journal of applied physics, 2004, 卷号: 96, 期号: 9, 页码: 4982-4988
作者:  Lu, Y;  Cong, GW;  Liu, XL;  Lu, DC;  Zhu, QS
收藏  |  浏览/下载：13/0  |  提交时间：2019/05/12
Reduction of tensile stress in gan grown on si(111) by inserting a low-temperature aln interlayer 期刊论文
Journal of crystal growth, 2004, 卷号: 270, 期号: 3-4, 页码: 316-321
作者:  Zhang, BS;  Wu, M;  Liu, JP;  Chen, J;  Zhu, JJ
收藏  |  浏览/下载：23/0  |  提交时间：2019/05/12
Investigation on the Interaction of Laser Beam and Metal Powders Conveyed by Coaxial Powder Feeder 会议论文
Sixth World Congress on Computational Mechanics in Conjunction with the Second Asian-Pacific Congress on Computational Mechanics, Sept. 5-10, 2004, Beijing, China
作者:  Yu G(虞钢)
收藏  |  浏览/下载：1379/55  |  提交时间：2007/12/18
Numeric Calculation for Transient Thermal Stress Field in Wall-Shape Metal Part During Laser Direct Forming 会议论文
Sixth World Congress on Computational Mechanics in Conjunction with the Second Asian-Pacific Congress on Computational Mechanics, Sept. 5-10, 2004, Beijing, China
作者:  Yu G(虞钢)
收藏  |  浏览/下载：1219/56  |  提交时间：2007/12/18
Characteristics of deformation and recovery in Ti50Ni47Fe3 shape memory alloy 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2004, 卷号: 20, 期号: 5, 页码: 605-608
作者:  Jin, W;  Yan, Y;  Wang, J;  Cao, MZ;  Yang, R
收藏  |  浏览/下载：1/0  |  提交时间：2021/02/02
The mechanical and thermal behaviors of glass bead filled polypropylene 期刊论文
POLYMERS FOR ADVANCED TECHNOLOGIES, 2004, 卷号: 15, 期号: 7, 页码: 409-413
作者:  Yuan, Q;  Jiang, W;  An, LJ;  Li, RKY
收藏  |  浏览/下载：10/0  |  提交时间：2019/04/09
Relationship between the yield strength and annealing temperature of a Cu film adherent to substrate 期刊论文
ACTA METALLURGICA SINICA, 2004, 卷号: 40, 期号: 7, 页码: 716-720
作者:  Qin, M;  Ji, V;  Li, JB;  Ma, SY;  Chen, CR
收藏  |  浏览/下载：5/0  |  提交时间：2021/02/02

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