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浏览/检索结果: 共5条，第1-5条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Effect of Ultrasound on Dissolution Acceleration Behavior of Ni/Sn 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 7, 页码: 2365-2371 作者:  Liu, Yun;  Yu, Weiyuan;  Sun, Jungang;  Sun, Xuemin;  Wang, Fengfeng 收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14 Binary alloys  Dissolution  Nickel  Tin  Ultrasonic effects  Acceleration behavior  Dissolution behavior  Holding time  Molten solders  Rod-shaped  Subsequent cooling  Ultrasonic cavitation  Ultrasonic vibration   Effect of Ultrasound on Dissolution Acceleration Behavior of Ni/Sn 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 7, 页码: 2365-2371 作者:  Liu, Yun;  Yu, Weiyuan;  Sun, Jungang;  Sun, Xuemin;  Wang, Fengfeng 收藏  |  浏览/下载：5/0  |  提交时间：2022/02/17 Binary alloys  Dissolution  Nickel  Tin  Ultrasonic effects  Acceleration behavior  Dissolution behavior  Holding time  Molten solders  Rod-shaped  Subsequent cooling  Ultrasonic cavitation  Ultrasonic vibration   Spreading process and interfacial characteristic of Sn-17Bi-0.5Cu/Ni at temperatures ranging from 523 K to 673 K 期刊论文 colloids and surfaces a physicochemical and engineering aspects, 2012 Zang, Likun; Yuan, Zhangfu; Zhu, Yuanqing; Xu, Bingsheng; Matsuura, Hiroyuki; Tsukihashi, Fumitaka 收藏  |  浏览/下载：2/0  |  提交时间：2015/11/12 Surfaces and interfaces  Intermetallics  Metals and alloys  Scanning electron microscopy (SEM)  Microstructure  LEAD-FREE SOLDERS  SN-AG-CU  SURFACE-TENSION  MOLTEN SILICON  WETTABILITY  SUBSTRATE  ALLOYS  DYNAMICS  SYSTEMS  AL   Application of electron backscatter diffraction to the study on orientation distribution of intermetallic compounds at heterogeneous interfaces (Sn/Ag and Sn/Cu) 期刊论文 Journal of Applied Physics, 2010, 卷号: 108, 期号: 10 H. F. Zou; Z. F. Zhang 收藏  |  浏览/下载：9/0  |  提交时间：2012/04/13 lead-free solders  microstructural evolution  molten sn  ebsd  morphology  texture  crystal  alloys  growth  joints   A study on the orientation relationship between the scallop-type Cu(6)Sn(5) grains and (011) Cu substrate using electron backscattered diffraction 期刊论文 Journal of Applied Physics, 2009, 卷号: 106, 期号: 11 H. F. Zou; H. J. Yang; Z. F. Zhang 收藏  |  浏览/下载：12/0  |  提交时间：2012/04/13 ageing  copper  copper alloys  electron backscattering  electron  diffraction  texture  tin alloys  wetting  lead-free solders  interfacial reactions  single-crystal  molten sn  growth  joints