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CORC

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Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11
作者:  Chen, Yinbo;  Gao, Zhaoqing;  Liu, Zhi-Quan
收藏  |  浏览/下载：11/0  |  提交时间：2022/07/01
Stability of Multilayered Ag/Ag3Sn/Sn Films Non-cyanide Electroplateded for high-reflective back-electrode 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Ji, Shengnan;  Wang, Chen;  Wang, Yunpeng;  Ma, Haitao;  Zhao, Ning
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
Cu6Sn5 Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer 期刊论文
MATERIALS, 2017, 卷号: 10, 期号: 4, 页码: -
Zhang, Liang; Liu, Zhi-quan; Yang, Fan; Zhong, Su-juan
收藏  |  浏览/下载：22/0  |  提交时间：2017/08/17
Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling 期刊论文
Journal of Electronic Materials, 2015, 卷号: 44, 期号: 1, 页码: 590-596
L. M.; Zhang Yang, Z. F.
收藏  |  浏览/下载：25/0  |  提交时间：2015/05/08
Study of IMC at interfaces of Sn3.0Ag0.5Cu3.0Bi0.05Cr/Cu joints during thermal ageing 期刊论文
SOLDERING & SURFACE MOUNT TECHNOLOGY, 2014, 卷号: 26, 页码: 173-179
作者:  Ju, Guokui[1];  Lin, Fei[2];  Bi, Wenzhen[3];  Han, Yongjiu[4];  Wang Junjie[5]
收藏  |  浏览/下载：7/0  |  提交时间：2019/04/30
Synchrotron radiation real-time in situ study on dissolution and precipitation of Ag3Sn plates in sub-50 mu m Sn-Ag-Cu solder bumps 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2014, 卷号: 602, 页码: 281-284
作者:  Huang, M. L.;  Yang, F.;  Zhao, N.;  Yang, Y. C.
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09
Dissolution and Precipitation of Ag3Sn Plates in Ultra Fine Solder Joints Using Synchrotron Radiation Real-time Imaging Technology 会议论文
14th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Dalian, PEOPLES R CHINA, 2013-08-11
作者:  Huang, Mingliang;  Yang, Fan;  Zhao, Ning;  Zhang, Fei
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/11
The nucleation of Ag3Sn and the growth orientation relationships with Cu6Sn5 会议论文
14th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Dalian, PEOPLES R CHINA, 2013-08-11
作者:  Qu, Lin;  Ma, Haitao;  Zhao, Huijing;  Zhao, Ning;  Kunwar, Anil
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/11
A Study on the Physical Properties and Interfacial Reactions with Cu Substrate of Rapidly Solidified Sn-3.5Ag Lead-Free Solder 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2013, 卷号: 42, 页码: 2686-2695
作者:  Ma, Hai-Tao;  Wang, Jie;  Qu, Lin;  Zhao, Ning;  Kunwar, A.
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/11
The comparative study on interfacial IMCs growth of three Cu/SnAgCu/Cu solder joints with Bi and Cr additions during thermal aging 会议论文
2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012-08-13
作者:  Ju, Guokui[1];  Bi, Wenzhen[2];  Lin, Fei[3];  Han, Yongjiu[4];  Wei, Xicheng[5]
收藏  |  浏览/下载：6/0  |  提交时间：2019/04/30

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