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CORC

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Study on the effects of interfacial interaction on the rheological and thermal performance of silica nanoparticles reinforced epoxy nanocomposites. 期刊论文
COMPOSITES PART B-ENGINEERING, 2017
作者:  Guo, Qian;  Zhu, Pengli;  Li, Gang;  Wen, Junjie;  Wang, Tianyu
收藏  |  浏览/下载：21/0  |  提交时间：2018/02/02
Improvements in thermo-mechanical and rheological properties of SiO2/epoxy composites using different types of SiO2 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2016
作者:  Gang Li;  Wenjie Zhang;  Pengli Zhu;  Daoqiang Lu;  Tao Zhao
收藏  |  浏览/下载：20/0  |  提交时间：2017/01/13
Cure kinetics study of a Novel Die Attach Adhesive for High Power Light-Emitting Diode 会议论文
China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China
作者:  Baotan Zhang;  Rong Sun;  Yankang Han;  Pengli Zhu;  Daoqiang(Daniel) Lu
收藏  |  浏览/下载：28/0  |  提交时间：2017/01/15
Low cost and highly conductive elastic composites for flexible and printable electronics 期刊论文
JOURNAL OF MATERIALS CHEMISTRY C, 2016
作者:  Hu, Yougen;  Zhao, Tao;  Zhu, Pengli;  Zhu, Yu;  Shuai, Xingtian
收藏  |  浏览/下载：27/0  |  提交时间：2017/01/13
Underfill Technology for Fine Pitch Flip Chip Application 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:  Pengli Zhu;  Gang Li;  Qian Guo;  Tao Zhao;  Daoqiang Lu
收藏  |  浏览/下载：41/0  |  提交时间：2017/01/15
Insights into the role of interface in the rheological property of underfill composites 会议论文
China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China
作者:  Qian Guo;  Pengli Zhu;  Junjie Wen;  Gang Li;  Tianyu Wang
收藏  |  浏览/下载：15/0  |  提交时间：2017/01/15
Mesoporous Silica Nanoparticles: A Potential Inorganic Filler To Prepare Polymer Composites With Low CTE And Low Modulus For Electronic Packaging Applications 会议论文
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), Las Vegas, NV
作者:  Li, Gang;  Zhu, Pengli;  Zhao, Tao;  Sun, Rong;  Lu, Daoqiang
收藏  |  浏览/下载：23/0  |  提交时间：2017/01/15
CURE KINETICS STUDY OF A NOVEL DIE ATTACH ADHESIVE FOR HIGH POWER LIGHT-EMITTING DIODE 会议论文
China Semiconductor Technology International Conference (CSTIC), Shanghai, PEOPLES R CHINA
作者:  Zhang, Baotan;  Sun, Rong;  Han, Yankang;  Zhu, Pengli;  Lu, Daoqiang
收藏  |  浏览/下载：7/0  |  提交时间：2020/01/03
Highly stable and re-dispersible nano Cu hydrosols with sensitively size-dependent catalytic and antibacterial activities 期刊论文
Nanoscale, 2015, 卷号: 7, 期号: 32, 页码: 13775-13783
作者:  Zhang, Yu;  Zhu, Pengli;  Li, Gang;  Wang, Wenzhao;  Chen, Liang
收藏  |  浏览/下载：25/0  |  提交时间：2015/10/29
Spherical and flake-like BN filled epoxy composites: morphological effect on the thermal conductivity, thermo-mechanical and dielectric properties 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2015
作者:  Liang Huang;  Pengli Zhu;  Gang Li;  Fengrui Zhou;  Daoqiang Lu
收藏  |  浏览/下载：26/0  |  提交时间：2016/01/27

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