CORC

在结果中检索

CORC

浏览/检索结果: 共20条，第1-10条 帮助

已选(0)清除 条数/页：   排序方式：
Microstructure, solderability, and growth of intermetallic compounds of Sn-Ag-Cu-RE lead-free solder alloys 期刊论文
Annual Meeting of the Minerals-Metals-and-Materials-Society, 2006, 卷号: 35, 页码: 89-93
作者:  Law, CMT;  Wu, CML;  Yu, DQ;  Wang, L;  Lai, JKL
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/27
Effects of Cu contents in Sn-Cu solder on the composition and morphology of intermetallic compounds at a solder/Ni interface 期刊论文
JOURNAL OF MATERIALS RESEARCH, 2005, 卷号: 20, 页码: 2205-2212
作者:  Yu, DQ;  Wu, CML;  He, DP;  Zhao, N;  Wang, L
收藏  |  浏览/下载：4/0  |  提交时间：2020/01/02
Intermetallic compounds growth between Sn-3.5Ag lead-free solder and Cu substrate by dipping method 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2005, 卷号: 392, 页码: 192-199
作者:  Yu, DQ;  Wu, CML;  Law, CMT;  Wang, L;  Lai, JKL
收藏  |  浏览/下载：3/0  |  提交时间：2020/01/02
Magnetic and ageing behaviour of 7MoPLUS and the viability of monitoring ferrite decomposition using AC magnetic susceptibility 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2005, 卷号: 406, 页码: 110-118
作者:  Lai, JKL;  Lo, KH;  Shek, CH;  Li, DJ
收藏  |  浏览/下载：3/0  |  提交时间：2020/01/02
Early-stage Widmanstatten growth of the gamma phase in a duplex steel 期刊论文
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2000, 卷号: 31, 页码: 15-19
作者:  Shek, CH;  Dong, C;  Lai, JKL;  Wong, KW
收藏  |  浏览/下载：1/0  |  提交时间：2020/01/02
Lead free solder alloys Sn-Zn and Sn-Sb prepared by mechanical alloying 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2000, 卷号: 11, 页码: 57-65
作者:  Huang, ML;  Wu, CML;  Lai, JKL;  Wang, L;  Wang, FG
收藏  |  浏览/下载：4/0  |  提交时间：2020/01/02
Microstructure and mechanical behaviour of a SiC particles reinforced Al-5Cu composite under dynamic loading 期刊论文
Journal of Materials Processing Technology, 1999, 卷号: 94, 期号: 2-3, 页码: 175-178
作者:  Lu YX;  Meng XM;  Lee CS;  Li RKY;  Huang CG(黄晨光)
收藏  |  浏览/下载：1010/33  |  提交时间：2007/06/15
Creep properties of aged duplex stainless steels containing sigma phase 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1999, 卷号: 266, 页码: 30-36
作者:  Shek, CH;  Li, DJ;  Wong, KW;  Lai, JKL
收藏  |  浏览/下载：1/0  |  提交时间：2020/01/02
Incommensurate modulated structure study of a Cu-Zn-Al-Zr phase 期刊论文
ACTA MATERIALIA, 1998, 卷号: 46, 期号: 15, 页码: 5541
Chung, CY; Zou, WH; Han, XD; Lam, CWH; Gao, M; Duan, XF; Lai, JKL
收藏  |  浏览/下载：20/0  |  提交时间：2013/09/17
Thermal-mechanical interface crack behaviour of a surface mount solder joint 期刊论文
Finite Elements in Analysis and Design, 1998, 卷号: 30, 期号: 1-2, 页码: 19-30
作者:  Wu CML;  Lai JKL;  Wu YL(吴永礼)
收藏  |  浏览/下载：788/66  |  提交时间：2007/06/15

©版权所有 ©2017 CSpace - Powered by CSpace