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	Microstructure, solderability, and growth of intermetallic compounds of Sn-Ag-Cu-RE lead-free solder alloys
	Law, CMT; Wu, CML; Yu, DQ; Wang, L; Lai, JKL
刊名	Annual Meeting of the Minerals-Metals-and-Materials-Society
	2006
卷号	35页码:89-93
关键词	lead-free solder rare earth (RE) elements solderability test intermetallic layer
ISSN号	0361-5235
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/5700560
专题	大连理工大学
作者单位	1.City Univ Hong Kong, Dept Phys & Mat Sci, Hong Kong, Hong Kong, Peoples R China. 2.Dalian Univ Technol, Dept Mat Engn, Dalian 116024, Peoples R China.
推荐引用方式 GB/T 7714	Law, CMT,Wu, CML,Yu, DQ,et al. Microstructure, solderability, and growth of intermetallic compounds of Sn-Ag-Cu-RE lead-free solder alloys[J]. Annual Meeting of the Minerals-Metals-and-Materials-Society,2006,35:89-93.
APA	Law, CMT,Wu, CML,Yu, DQ,Wang, L,&Lai, JKL.(2006).Microstructure, solderability, and growth of intermetallic compounds of Sn-Ag-Cu-RE lead-free solder alloys.Annual Meeting of the Minerals-Metals-and-Materials-Society,35,89-93.
MLA	Law, CMT,et al."Microstructure, solderability, and growth of intermetallic compounds of Sn-Ag-Cu-RE lead-free solder alloys".Annual Meeting of the Minerals-Metals-and-Materials-Society 35(2006):89-93.

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