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浏览/检索结果: 共3条，第1-3条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Characterization of nano-enhanced interconnect materials for fine pitch assembly 期刊论文 Soldering and Surface Mount Technology, 2014, 卷号: 26, 页码: 12-17 作者:  Zhang, Yan[1];  Sitek, Janusz[2];  Fan, Jing-Yu[3];  Ma, Shiwei[4];  Koscielski, Marek[5] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/30 CNT  Conductive adhesives  Flexible PCBs  Nano-Ag paste   Influence of nano additives on mechanical properties and reliability of interconnects made by electrically conductive adhesives on elastic substrates for printed electronics application 会议论文 15th International Conference on Electronic Packaging Technology (ICEPT), 2014-08-12 作者:  Sitek, Janusz[1];  Koscielski, Marek[2];  Zhang, Yan[3];  Fan, Jing-Yu[4];  Ma, Shiwei[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30 Electrically conductive adhesives  nano additives  mechanical properties  reliability of interconnects  printed electronics   Comparisons of Nano-Additives Influence on Properties of the Bi-Modal Solder Pastes for Special Applications 会议论文 12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011-08-08 作者:  Sitek, Janusz[1];  Zhang, Yan[2];  Ma, Shiwei[3];  Liu, Johan[4];  Ga, Yulai[5] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/30