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CORC

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Guidelines for the use and interpretation of assays for monitoring autophagy (4th edition) 期刊论文
AUTOPHAGY, 2021, 卷号: 17
作者:  Klionsky, Daniel J.;  Abdel-Aziz, Amal Kamal;  Abdelfatah, Sara;  Abdellatif, Mahmoud;  Abdoli, Asghar
收藏  |  浏览/下载：267/0  |  提交时间：2021/05/31
Electromigration-induced -Sn grain rotation in lead-free flip chip solder bumps 会议论文
69th IEEE Electronic Components and Technology Conference, ECTC 2019, Las Vegas, NV, United states, 2019-05-28
作者:  Huang, Mingliang L.;  Kuang, Jiameng M.;  Sun, Hongyu Y.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Effects of electromigration on microstructural evolution and mechanical properties of preferential growth intermetallic compound interconnects for 3D packaging 会议论文
69th IEEE Electronic Components and Technology Conference, ECTC 2019, Las Vegas, NV, United states, 2019-05-28
作者:  Huang, Mingliang L.;  Zou, Lin
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/02
TRAF6-mediated ubiquitination of APPL1 enhances hepatic actions of insulin by promoting the membrane translocation of Akt 期刊论文
BIOCHEMICAL JOURNAL, 2013, 卷号: 455
Cheng, Kenneth K. Y.; Lam, Karen S. L.; Wang, Yu; Wu, Donghai; Zhang, Mingliang; Wang, Baile; Li, Xiaomu; Hoo, Ruby L. C.; Huang, Zhe; Sweeney, Gary; Xu, Aimin
收藏  |  浏览/下载：18/0  |  提交时间：2016/12/16
TRAF6-mediated ubiquitination of APPL1 enhances hepatic actions of insulin by promoting the membrane translocation of Akt 期刊论文
BIOCHEMICAL JOURNAL, 2013, 卷号: 455
作者:  Wang, Yu;  Zhang, Mingliang;  Xu, Aimin;  Sweeney, Gary;  Huang, Zhe
收藏  |  浏览/下载：21/0  |  提交时间：2018/12/13
Ectopic expression of RASSF2 and its prognostic role for gastric adenocarcinoma patients 期刊论文
Experimental and Therapeutic Medicine, 2012, 卷号: 3, 期号: 3
作者:  Luo, Deng[0];  Ye, Ting[1];  Li, TianQian[2];  Tang, Peng[3];  Min, ShaDong[4]
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/19
The adsorption of Ag3Sn nano-particles on Cu-Sn intermetallic compounds of Sn-3Ag-0.5Cu/Cu during soldering 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2010, 卷号: 492, 页码: 433-438
作者:  Liu, Xiaoying;  Huang, Mingliang;  Zhao, Yanhui;  Wu, C. M. L.;  Wang, Lai
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/24
Effect of Y2O3 particles on microstructure formation and shear properties of Sn-58Bi solder 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2010, 卷号: 21, 页码: 1046-1054
作者:  Liu, Xiaoying;  Huang, Mingliang;  Wu, C. M. L.;  Wang, Lai
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/24
Liquid-state Interfacial Reactions between Sn-Ag-Cu-Fe Composite Solders and Cu Substrate 会议论文
International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, PEOPLES R CHINA, 2009-08-10
作者:  Liu, Xiaoying;  Zhao, Yanhui;  Huang, Mingliang;  Wu, C. M. L.;  Wang, Lai
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/24
Effect of Electromigration on Intermetallic Compound Formation in Cu/Sn/Cu Interconnect 会议论文
International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, PEOPLES R CHINA, 2009-01-01
作者:  Chen, L. D.;  Huang, Mingliang
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/24

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