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CORC

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Effect of soldering temperature on cross-interaction at L-S interface of linear Cu/SAC305/Ni solder joints 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Guo, Bingfeng;  Huang, Ru;  Yao, Jinye;  Qi, Xiao;  Kunwar, Anil
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
Synchrotron radiation imaging study on the rapid IMC growth of Sn-xAg solders with Cu and Ni substrates during the heat preservation stage 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 页码: 589-601
作者:  Guo, Bingfeng;  Kunwar, Anil;  Jiang, Chengrong;  Zhao, Ning;  Sun, Junhao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling 期刊论文
INTERMETALLICS, 2018, 卷号: 93, 页码: 186-196
作者:  Kunwar, Anil;  Guo, Bingfeng;  Shang, Shengyan;  Raback, Peter;  Wang, Yunpeng
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints 期刊论文
MATERIALS RESEARCH BULLETIN, 2018, 卷号: 99, 页码: 239-248
作者:  Guo, Bingfeng;  Kunwar, Anil;  Zhao, Ning;  Chen, Jun;  Wang, Yunpeng
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
Complete Chloroplast Genome Sequence and Phylogenetic Analysis of Aster tataricus 期刊论文
MOLECULES, 2018, 卷号: 23, 期号: 10
作者:  Shen, Xiaofeng;  Guo, Shuai;  Yin, Yu;  Zhang, Jingjing;  Yin, Xianmei
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/11
Pharmacokinetics and Preliminary Pharmacodynamics of Single- and Multiple-dose Lyophilized Recombinant Glucagon-like Peptide-1 Receptor Agonist (rE-4) in Chinese Patients with Type 2 Diabetes Mellitus 期刊论文
CLINICAL DRUG INVESTIGATION, 2017, 卷号: 37, 期号: 12
作者:  Fang, Yi;  Xu, Bingfeng;  Zhu, Lixia;  Wang, Yitong;  Lou, Kun
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/05
Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder joints at the Sn/Cu liquid-solid interface during soldering cooling stage 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2017, 卷号: 28, 页码: 5398-5406
作者:  Guo, Bingfeng;  Ma, Haitao;  Jiang, Chengrong;  Wang, Yunpeng;  Kunwar, Anil
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02
In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/Cu L-S interface during soldering heat preservation stage 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Guo, Bingfeng;  Jiang, Chengrong;  Kunwar, Anil;  Chen, Jun;  Zhao, Ning
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
Effect of Ag concentration on the Cu6Sn5 growth in Sn-based solder/Cu joints at the isothermal reflow stage 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Guo, Bingfeng;  Jiang, Chengrong;  Kunwar, Anil;  Zhao, Ning;  Chen, Jun
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
Pharmacokinetics and Preliminary Pharmacodynamics of Single- and Multiple-dose Lyophilized Recombinant Glucagon-like Peptide-1 Receptor Agonist (rE-4) in Chinese Patients with Type 2 Diabetes Mellitus 期刊论文
Clinical drug investigation, 2017, 卷号: 37, 页码: 1107-1115
作者:  Wang Yitong[1];  Xu Bingfeng[2];  Zhu Lixia[3];  Lou Kun[4];  Chen Yingli[5]
收藏  |  浏览/下载：4/0  |  提交时间：2019/04/26

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