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浏览/检索结果: 共8条，第1-8条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Noise coupling between through-silicon vias and active devices for 20/14-nm technology nodes (CPCI-S收录) 会议 作者:  Fang, Runiu[1];  Sun, Xin[1];  Miao, Min[2];  Jin, Yufeng[1,3] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/11 High Frequency Analysis and Characterization of TSVs for High-Speed Integrated Systems (CPCI-S收录) 会议 作者:  Miao, Min[1,2];  Fang, Runiu[2];  Sun, Xin[2];  Cui, Xiaole[2,3];  Jin, Yufeng[2,3] 收藏  |  浏览/下载：10/0  |  提交时间：2019/04/11 Through silicon via  MOS effect  Noise coupling   Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration (CPCI-S收录) 会议 作者:  Liu, Huan[1];  Zeng, Qinghua[1];  Guan, Yong[1];  Fang, Runiu[1];  Sun, Xin[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Bias-dependent High Frequency Characterization of Through-Silicon Via (TSV) for 3D Integration (CPCI-S收录) 会议 作者:  Sun, Xin[1];  Fang, Runiu[1];  Liu, Huan[1];  Miao, Min[2];  Jin, Yufeng[3] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 Through-silicon via (TSV)  S parameter  RLGC extraction  MOS effect   Low-frequency Testing of Through Silicon Vias for Defect Diagnosis in Three-dimensional Integration Circuit Stacking Technology (CPCI-S收录) 会议论文 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 作者:  Xu, Yichao[1,3];  Miao, Min[1,2];  Fang, Runiu[1];  Sun, Xin[1];  Zhu, Yunhui[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/12 Electrical Measurement and Analysis of TSV/RDL for 3D Integration (CPCI-S收录) 会议论文 2014 IEEE 16TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC) 作者:  Sun, Xin[1];  Fang, Runiu[1];  Zhu, Yunhui[1];  Zhong, Xiao[1];  Bian, Yuan[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/12 Investigation of a TSV-RDL In-line Fault-Diagnosis System and Test Methodology for Wafer-level Commercial Production (CPCI-S收录) 会议论文 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 作者:  Fang, Runiu[1];  Miao, Min[2];  Sun, Xin[1];  Zhu, Yunhui[1];  Wang, Guanjiang[3] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/12 Understanding Effect of Additives in Copper Electroplating Filling for Through Silicon Via (CPCI-S收录) 会议论文 2012 IEEE 11TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT-2012) 作者:  Miao, Min[1,2];  Zhu, Yunhui[1];  Bian, Yuan[1];  Sun, Xin[1];  Ma, Shenglin[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15