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A Structure and Circuit Coupling Modeling Method for Flexible Interconnection Points and Transmission Performance of Gold Belt in Microwave Modules 会议论文
Hong Kong, China, August 12, 2019 - August 15, 2019
作者:  Tian, Jun;  Wang, Congsi;  Liu, Shaoyi;  Zhu, Cheng;  Zhou, Cheng
收藏  |  浏览/下载：18/0  |  提交时间：2021/07/06
Highly solderability of FeP film in contact with SnAgCu solder 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2020, 卷号: 818, 页码: 6
作者:  Zhou, Haifei;  Guo, Jingdong;  Shang, Jianku;  Song, Xiaoning
收藏  |  浏览/下载：12/0  |  提交时间：2021/02/02
A Reliability-Aware Joint Design Method of Application Mapping and Wavelength Assignment for WDM-Based Silicon Photonic Interconnects on Chip 期刊论文
IEEE ACCESS, 2020, 卷号: 8, 页码: 73457-73474
作者:  Li, Hui;  Liu, Feiyang;  Gu, Huaxi;  Chu, Zhuqin;  Ye, Xiaochun
收藏  |  浏览/下载：15/0  |  提交时间：2020/12/10
Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure 期刊论文
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2018, 卷号: 6, 期号: 1, 页码: 175, 187
作者:  Zhang, Hui;  Li, Jianfeng;  Dai, Jingru;  Corfield, Martin;  Liu, Xuejian
收藏  |  浏览/下载：31/0  |  提交时间：2018/12/28
Binary Synergistic Sensitivity Strengthening of Bioinspired Hierarchical Architectures based on Fragmentized Reduced Graphene Oxide Sponge and Silver Nanoparticles for Strain Sensors and Beyond 期刊论文
SMALL, 2017
Zhao, Songfang; Guo, Lingzhi; Li, Jinhui; Li, Ning; Zhang, Guoping; Gao, Yongju; Li, Jia; Cao, Duxia; Wang, Wei; Jin, Yufeng; Sun, Rong; Wong, Ching-Ping
收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03
Fabrication and Comparison of Bumpless Wafer-on-Wafer Integration and Bump-Containing Chip-on-Chip Integration 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2017
Guan, Yong; Zhu, Yunhui; Ma, Shenglin; Zeng, Qinghua; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
TOP METAL LAYER ELECTRO PLATING EDGE BEVEL REMOVAL IMPROVEMENT STUDY 其他
2016-01-01
Liu, Jianqiang; Wu, Hanming; Zhang, Xing; Wang, Yi; Tian, Chao; Sun, Liang
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Top metal layer electro plating edge bevel removal improvement study 其他
2016-01-01
Liu, Jianqiang; Wu, Hanming; Zhang, Xing; Wang, Yi; Tian, Chao; Sun, Liang
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Tomographic observation of integrated circuit based on X-ray microscopy 期刊论文
Proceedings of SPIE, 2015, 卷号: 9672, 页码: 96720R
作者:  Xi;  XQ;  Li;  L;  Yan
收藏  |  浏览/下载：16/0  |  提交时间：2016/04/18
A Wafer Level Through-Stack-Via Integration Process with One-time Bottom-up Copper Filling 其他
2014-01-01
Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Fang, Runiu; Zhong, Xiao; Bian, Yuan; Guan, Yong; Chen, Jing; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03

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