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Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 8
作者:  Yang, Jie;  Zhang, Qingke;  Song, Zhenlun
收藏  |  浏览/下载：133/0  |  提交时间：2021/02/02
Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020
作者:  Yang, Jie;  Zhang, Qingke;  Song, Zhenlun
收藏  |  浏览/下载：3/0  |  提交时间：2020/12/16
TENSILE  JOINTS  SILVER  CU  
A study on the oxygen plasma treatment on the peel adhesion strength and solder wettability of SnBi58 based anisotropic conductive films 会议论文
69th IEEE Electronic Components and Technology Conference, ECTC 2019, Las Vegas, NV, United states, 2019-05-28
作者:  Zhang, Shuye;  Huang, Mingliang;  Wu, Yang;  Yang, Ming;  Lin, Tiesong
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/02
Influences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joints 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 20, 页码: 18524-18538
作者:  Wang, Z.;  Zhang, Q. K.;  Chen, Y. X.;  Song, Z. L.
收藏  |  浏览/下载：19/0  |  提交时间：2019/12/18
Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction 期刊论文
MATERIALS LETTERS, 2018, 卷号: 214, 页码: 142-145
作者:  Jiang, J. J.;  Hu, F. Q.;  Zhang, Q. K.;  Song, Z. L.
收藏  |  浏览/下载：19/0  |  提交时间：2018/12/04
Ex situ observations of fast intermetallic growth on the surface of interfacial region between eutectic SnBi solder and Cu substrate during solid-state aging process 期刊论文
Microelectronics Reliability, 2013, 卷号: 53, 期号: 6, 页码: 899-905
P. J. Shang; L. Zhang; Z. Q. Liu; J. Tan; J. K. Shang
收藏  |  浏览/下载：11/0  |  提交时间：2013/12/24
Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2012, 卷号: 532, 页码: 167-177
H. F. Zou; Q. K. Zhang; Z. F. Zhang
收藏  |  浏览/下载：16/0  |  提交时间：2013/02/05
Effects of Bi segregation on the tensile properties of Cu/Cu3Sn(100) interface 期刊论文
MICROELECTRONICS RELIABILITY, 2011, 卷号: 51, 期号: 12, 页码: 2330-2335
作者:  Pang, X. Y.;  Liu, Z. Q.;  Wang, S. Q.;  Shang, J. K.
收藏  |  浏览/下载：15/0  |  提交时间：2021/02/02
Effects of Bi segregation on the tensile properties of Cu/Cu(3)Sn(100) interface 期刊论文
Microelectronics Reliability, 2011, 卷号: 51, 期号: 12, 页码: 2330-2335
X. Y. Pang; Z. Q. Liu; S. Q. Wang; J. K. Shang
收藏  |  浏览/下载：15/0  |  提交时间：2012/04/13
In situ observations on shear and creep-fatigue fracture behaviors of SnBi/Cu solder joints 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2011, 卷号: 528, 期号: 6, 页码: 2686-2693
Q. K. Zhang; Z. F. Zhang
收藏  |  浏览/下载：10/0  |  提交时间：2012/04/13

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