CORC

浏览/检索结果: 共47条,第1-10条 帮助

已选(0)清除 条数/页:   排序方式:
High-entropy FeCoNiMnCu alloy coating on ferritic stainless steel for solid oxide fuel cell interconnects 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2022, 卷号: 908, 页码: 12
作者:  Zhao, Qingqing;  Geng, Shujiang;  Zhang, Yu;  Chen, Gang;  Zhu, Shenglong
收藏  |  浏览/下载:32/0  |  提交时间:2022/07/14
CrxN/Mn1.7Cu1.3 coating on ferritic stainless steel for solid oxide fuel cell interconnects 期刊论文
MATERIALS LETTERS, 2022, 卷号: 306, 页码: 3
作者:  Zhao, Qingqing;  Geng, Shujiang;  Chen, Gang;  Zhu, Shenglong;  Wang, Fuhui
收藏  |  浏览/下载:26/0  |  提交时间:2021/11/22
Interfacial Structure and Mechanical Properties of Lead-Free Bi-Containing Solder/Cu Microelectronic Interconnects 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2021, 卷号: 50, 期号: 1, 页码: 258-262
作者:  Liu, C. Z.;  Wang, J. J.;  Zhu, M. W.;  Liu, X. M.;  Lu, T. N.
收藏  |  浏览/下载:25/0  |  提交时间:2021/02/03
Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
作者:  Song M;  Wei ZQ;  Wang BY;  Chen L;  Chen L
收藏  |  浏览/下载:53/0  |  提交时间:2019/11/27
Communication-Electrodeposition of Nano-Twinned Cu in Void-Free Filling for Blind Microvia of High Density Interconnect 期刊论文
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2018, 卷号: 166, 期号: 1, 页码: D3097-D3099
作者:  Zhu, QS;  Zhang, X;  Li, SJ;  Liu, CZ;  Li, CF
收藏  |  浏览/下载:25/0  |  提交时间:2018/12/25
Communication-Electrodeposition of Nano-Twinned Cu in Void-Free Filling for Blind Microvia of High Density Interconnect 期刊论文
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2018, 卷号: 166, 期号: 1, 页码: D3097-D3099
作者:  Zhu, Qingsheng;  Zhang, Xian;  Li, Sujie;  Liu, Chunzhong;  Li, Cai-Fu
收藏  |  浏览/下载:7/0  |  提交时间:2021/02/02
In situ study on the effect of Cu5Zn8 intermetallic layer on the Cu-Ni cross interaction in Cu/Sn-9Zn/Ni interconnect under temperature gradient 期刊论文
MATERIALS CHEMISTRY AND PHYSICS, 2018, 卷号: 216, 页码: 130-135
作者:  Zhong, Y.;  Zhao, N.;  Dong, W.;  Wang, Y. P.;  Ma, H. T.
收藏  |  浏览/下载:8/0  |  提交时间:2019/12/02
CVD Synthesis of Monodisperse Graphene/Cu Microparticles with High Corrosion Resistance in Cu Etchant 期刊论文
MATERIALS, 2018, 卷号: 11
作者:  Li, Shuangyi[1];  Hou, Baosen[2];  Dai, Dan[3];  Shu, Shengcheng[4];  Wu, Mingliang[5]
收藏  |  浏览/下载:10/0  |  提交时间:2019/04/22
Cu互连技术中薄膜扩散阻挡层的制备及热稳定性研究 学位论文
2017, 2016
戴拖
收藏  |  浏览/下载:5/0  |  提交时间:2017/06/20


©版权所有 ©2017 CSpace - Powered by CSpace