Communication-Electrodeposition of Nano-Twinned Cu in Void-Free Filling for Blind Microvia of High Density Interconnect

doi:10.1149/2.0131901jes

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	Communication-Electrodeposition of Nano-Twinned Cu in Void-Free Filling for Blind Microvia of High Density Interconnect
	Zhu, Qingsheng 2; Zhang, Xian 2; Li, Sujie 2; Liu, Chunzhong 1; Li, Cai-Fu 3
刊名	JOURNAL OF THE ELECTROCHEMICAL SOCIETY
	2018-11-09
卷号	166 期号:1 页码:D3097-D3099
ISSN号	0013-4651
DOI	10.1149/2.0131901jes
通讯作者	Zhu, Qingsheng(qszhu@mir.ac.cn) ; Zhang, Xian(xzhang14s@imr.ac.cn) ; Liu, Chunzhong(czliu@sau.edu.cn)
英文摘要	Large-scale Cu nanotwins were electrodeposited in void-free filling within blind microvia using single gelatin as additive in electrolyte. The void-free filling effect was might be caused by a gradient suppressing effect of gelatin along the microvia depth. The gradient distribution of gelatin was resulted from the strong dependence of adsorption on convection force. The adsorbed gelatin might greatly increase the surface tension on the depositing atom plane and then dragged a layer of adatom to a misarranged sites in the lattice, leading to the twinning nucleation. (C) The Author(s) 2018. Published by ECS.
资助项目	National Natural Science Foundation of China (NSFC)[51471180] ; Science and Technology Program of Shenyang[F16-205-1-18]
WOS研究方向	Electrochemistry ; Materials Science
语种	英语
出版者	ELECTROCHEMICAL SOC INC
WOS记录号	WOS:000449759700001
资助机构	National Natural Science Foundation of China (NSFC) ; Science and Technology Program of Shenyang
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/130342]
专题	金属研究所_中国科学院金属研究所
通讯作者	Zhu, Qingsheng; Zhang, Xian; Liu, Chunzhong
作者单位	1.Shenyang Aerosp Univ, Coll Mat Sci & Engn, Shenyang 110136, Liaoning, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China 3.Osaka Univ Ibaraki, Inst Sci & Ind Res, Osaka, Japan
推荐引用方式 GB/T 7714	Zhu, Qingsheng,Zhang, Xian,Li, Sujie,et al. Communication-Electrodeposition of Nano-Twinned Cu in Void-Free Filling for Blind Microvia of High Density Interconnect[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY,2018,166(1):D3097-D3099.
APA	Zhu, Qingsheng,Zhang, Xian,Li, Sujie,Liu, Chunzhong,&Li, Cai-Fu.(2018).Communication-Electrodeposition of Nano-Twinned Cu in Void-Free Filling for Blind Microvia of High Density Interconnect.JOURNAL OF THE ELECTROCHEMICAL SOCIETY,166(1),D3097-D3099.
MLA	Zhu, Qingsheng,et al."Communication-Electrodeposition of Nano-Twinned Cu in Void-Free Filling for Blind Microvia of High Density Interconnect".JOURNAL OF THE ELECTROCHEMICAL SOCIETY 166.1(2018):D3097-D3099.